Doped Strained Flexible Thin-Film Transistors

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Solution Overview

Problem

The challenge lies in fabricating doped, free-standing, strained Si nanomembranes for high-speed flexible electronics, as existing methods fail to effectively sustain strain in transferrable single-crystalline Si nanomembranes, which is crucial for enhanced electron mobility and high-speed device fabrication.

Innovation Solution

The development of semiconductor trilayer structures with self-sustained strain, comprising a first and third layer of single-crystalline semiconductor material and a second layer of strained semiconductor material, where the second layer is sandwiched between the first and third layers, allowing for strain sharing and doping to define source, drain, and gate regions, enabling the creation of mechanically flexible radiofrequency transistors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If strain techniques are implemented in transferrable single-crystalline Si nanomembranes to enhance carrier mobility, then electron mobility is improved, but the ability to self-sustain strain is lost due to the free-standing nature of the nanomembranes

Engineering Contradiction:
Improveelectron mobilityVSAvoidstrain sustainability
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The nanomembrane is segmented into a trilayer structure with distinct functional layers: a strained SiGe layer for providing strain, a Si channel layer for carrier transport, and a cap layer for protection. This segmentation allows each layer to perform its specific function while working together to resolve the contradiction between mobility enhancement and strain sustainability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention uses composite material structure combining Si and SiGe layers. The SiGe layer provides tensile strain to the Si channel layer through lattice mismatch, enabling high electron mobility in the free-standing nanomembrane without requiring a rigid substrate. This composite approach allows the nanomembrane to self-sustain strain while maintaining flexibility.

Inventive Principle:
Principle #40Composite materials

2Speed

If doping is applied to Si nanomembranes for high-speed device fabrication, then device speed is improved, but the successful fabrication of doped free-standing strained Si nanomembranes has not been achieved

Engineering Contradiction:
Improvedevice speedVSAvoidfabrication success
Core Design Contradiction:
SpeedVSEase of manufacture

Solution Approach 1:

Doping is performed preliminarily on the Si channel layer before releasing the nanomembrane from the sacrificial substrate. This preliminary doping action allows the dopants to be incorporated into the strained trilayer structure before the complex release process, ensuring successful fabrication of doped free-standing strained nanomembranes while maintaining both strain and doping benefits for high-speed operation.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a significant enhancement of electron mobility and operational speed, with strained transistors achieving frequencies up to 15.1 GHz and power savings, while maintaining mechanical flexibility and performance even under bending conditions.

Implementation Method 1

the trilayer structure has self-sustained strain that is shared between the three layers

Methodology Applied
Scientific EffectStrain sharing: Elasticity

Data Source

PatentUS9006785B2Doped and strained flexible thin-film transistors
Publication Date: 2015.04.14 WISCONSIN ALUMNI RES FOUND
  • US9006785B2 patent drawing
  • US9006785B2 patent drawing
  • US9006785B2 patent drawing

AI summary

Semiconductor trilayer structures that are doped and strained are provided. Also provided are mechanically flexible transistors, including radiofrequency transistors, incorporating the trilayer structures and methods for fabricating the trilayer structures and transistors. The trilayer structures comprise a first layer of single-crystalline semiconductor material, a second layer of single-crystalline semiconductor material and a third layer of single-crystalline semiconductor material. In the structures, the second layer is in contact with and sandwiched between the first and third layers and the first layer is selectively doped to provide one or more doped regions in the layer.