DOPO Additive Flame Retardant in Epoxy Resin
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional epoxy resin formulations rely on reactive organophosphorus flame retardants for high glass transition temperatures and dimensional stability, limiting the use of additive organophosphorus flame retardants derived from 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide (DOPO) due to the perceived need for covalent bonding.
Innovation Solution
Development of a flame retardant epoxy composition incorporating additive DOPO-derived compounds, specifically 6H-ibenz[c,e][1,2]oxaphosphorin, 6,6'-(1,4-ethanediyl)bis-, 6,6'-dioxide, which does not require covalent bonding with the epoxy resin, enhancing flame retardancy while maintaining thermal stability and processability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reactive organophosphorus flame retardants are used to achieve high glass transition temperatures and dimensional stability, then flame retardancy and thermal stability are improved, but the requirement for covalent bonding limits the types of flame retardants that can be used and increases complexity
Solution Approach 1:
The patent applies this principle by using additive flame retardants that do not require covalent bonding with the epoxy resin, replacing the traditional reactive flame retardants that form permanent chemical bonds. The additive flame retardants achieve effective flame protection without the need for complex chemical bonding mechanisms, simplifying the formulation while maintaining reliability.
Solution Approach 2:
The patent changes the fundamental parameter of bonding mechanism from covalent (reactive) to physical (additive). This parameter change allows the use of DOPO-derived compounds that function as flame retardants through physical presence in the matrix rather than through chemical bonding, thereby reducing formulation complexity while maintaining flame retardancy.
2Reliability
If halogen-containing flame retardants are used to achieve effective flame protection, then flame retardancy is improved, but environmental and human safety concerns worsen
Solution Approach 1:
The patent converts the traditionally harmful halogen-based flame retardant approach into a beneficial environmentally-friendly alternative by using organophosphorous compounds. These DOPO-derived additive flame retardants provide equivalent or superior flame protection while eliminating the harmful environmental and health effects associated with halogen-containing compounds.
Solution Approach 2:
The patent changes the chemical composition parameter from halogen-based to phosphorus-based flame retardants. This parameter change fundamentally alters the environmental profile of the flame retardant system, replacing toxic halogen compounds with environmentally benign organophosphorous compounds while maintaining flame retardancy performance.
3Object-affected harmful factors
If additive organophosphorus flame retardants are used to improve environmental friendliness, then environmental safety is improved, but covalent bonding is believed to be necessary for maintaining thermal stability
Solution Approach 1:
The patent uses additive flame retardants that function through physical presence rather than permanent chemical bonding. These compounds provide the necessary flame protection and thermal stability through their molecular structure and interaction with the polymer matrix, eliminating the need for covalent bonding while maintaining dimensional stability.
Solution Approach 2:
The patent creates a composite system where additive DOPO-derived flame retardants work synergistically with the epoxy resin matrix. The combination achieves dimensional stability and thermal performance through the integrated properties of the composite material system rather than relying solely on covalent bonding between flame retardant and resin.
Data Source
AI summary
This invention relates to 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide derived additive flame-retardants, which are useful in epoxy resin compositions. The epoxy resin compositions may be used in making prepregs or laminates for printed wiring boards and composite materials.