DOPO Derivative Flame Retardant for Low Dielectric PCBs
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Solution Overview
Problem
Conventional halogen-free printed circuit board materials face challenges in meeting requirements for low dielectric constant and dissipation factor, high peel strength, thermal resistance after moisture absorption, and flame retardancy, while also experiencing issues with resin filling property and dimensional stability.
Innovation Solution
A phosphorus-containing compound represented by Formula (1) is developed, which is used to create a phosphorus-containing flame retardant and incorporated into a resin composition with an unsaturated bond-containing resin, along with other optional components, to enhance the properties of the printed circuit board materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If DOPO-containing phenol novolac resin is used to increase glass transition temperature and improve thermal resistance, then thermal resistance after moisture absorption is improved, but dielectric constant and dissipation factor increase (poor dielectric properties)
Solution Approach 1:
The patent modifies the molecular structure parameters of DOPO derivatives by introducing specific hydrophobic groups and controlling the arrangement of hydroxyl groups, thereby changing the balance between thermal resistance and dielectric properties. The structural parameters (m, n, a values in Formula 1) are optimized to achieve both high thermal resistance and low dielectric constant.
Solution Approach 2:
The patent creates composite flame retardant systems by combining multiple DOPO derivative components with specific functional groups, where each component contributes different properties. The composite structure allows simultaneous achievement of thermal resistance, low dielectric properties, and good resin filling performance.
2Ease of manufacture
If conventional DOPO-modified polyphenylene ether resin is used to lower dielectric properties, then dielectric constant and dissipation factor are improved, but phosphorus content is low resulting in unsatisfactory flame retardancy
Solution Approach 1:
The patent optimizes the phosphorus content parameter in DOPO derivatives by adjusting the molecular structure (values of m, n, a in Formula 1) to achieve high phosphorus content while maintaining low dielectric properties. This resolves the contradiction between flame retardancy requiring high phosphorus content and dielectric properties requiring low phosphorus content.
3Reliability
If DOPO derivative flame retardant is added to achieve UL94 V-0 flame retardancy, then flame retardancy is improved, but resin filling property of prepregs deteriorates
Solution Approach 1:
The patent modifies the molecular weight and structural parameters of DOPO derivatives (Formula 1) to optimize resin filling property while maintaining flame retardancy. The structural parameters are controlled to ensure proper flow and filling characteristics during manufacturing.
4Ease of manufacture
If material composition is optimized for low dielectric constant, then dielectric properties are improved, but peel strength between copper foil and insulation layer decreases
Solution Approach 1:
The patent introduces specific functional groups (A, A′, B, D in Formula 1) at different locations of the molecular structure to provide localized functions: some groups contribute to low dielectric properties while others enhance adhesion to copper foil, achieving both low dielectric constant and high peel strength through spatial differentiation of functional properties.
Data Source
AI summary
A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.