Flexible Dot Matrix Clamping for Low-Deformation Disk Machining
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Solution Overview
Problem
Existing bonding apparatuses and methods for disk-type planar components face challenges in achieving optimal clamping during machining due to high deformation and stress issues, particularly due to the large diameter-thickness ratio and poor rigidity, which affects surface shape accuracy.
Innovation Solution
A flexible dot matrix bonding apparatus with adjustable bonding positions, comprising a substrate, connecting rods, and an auxiliary support, utilizing a combination of threaded holes, arc grooves, and silicone rubber plates to adapt to varying stress states, allowing for reduced clamping deformation and enhanced surface accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum adsorption clamping method is used to firmly clamp the planar component, then the clamping reliability is improved, but the clamping deformation increases and the stress release is strongly constrained
Solution Approach 1:
The patent divides the bonding area into multiple discrete bonding points (lug bosses) distributed across the fixture surface. This segmentation allows the workpiece to be clamped at specific locations while leaving other areas free to deform and release stress during machining, thereby reducing overall clamping deformation and improving surface shape accuracy while maintaining clamping reliability at the bonding points.
Solution Approach 2:
The patent applies bonding only at specific local areas (lug bosses) rather than the entire surface. This local bonding approach provides sufficient clamping reliability at the bonding points while allowing the unsupported areas to accommodate stress release and elastic deformation during machining, thus resolving the contradiction between clamping reliability and manufacturing precision.
2Manufacturing precision
If the bonding area is reduced by reducing the number of lug bosses, then the constraint effect on stress release is weakened, but the unsupported area increases and elastic cutter relieving deformation is intensified
Solution Approach 1:
The patent employs an adjustable bonding apparatus where the number, position, and height of lug bosses can be modified according to different workpiece requirements and machining stages. This dynamic adjustability allows optimization of the balance between bonding area and unsupported area, enabling the system to adapt to varying stress states and achieve optimal clamping for each specific case.
Solution Approach 2:
The patent changes key parameters including the number of bonding points, their spatial distribution, and the height of connecting rods to optimize the balance between support and stress release. By adjusting these parameters, the system can weaken constraint effect where needed while maintaining sufficient support, thereby controlling both stress release and elastic deformation.
3Ease of manufacture
If a fixed structure special fixture is used, then the manufacturing simplicity is improved, but the adaptability to different disk-type components and machining stages is poor
Solution Approach 1:
The patent designs a universal bonding apparatus with standardized components (substrate, connecting rods, lug bosses) that can be configured for different workpiece sizes, shapes, and machining requirements. The adjustable number and positions of bonding points, combined with height-adjustable connecting rods, enable a single fixture design to serve multiple disk-type components and different machining stages, achieving versatility without sacrificing manufacturing simplicity.
Solution Approach 2:
The patent transforms the fixed structure into a dynamic, adjustable system where bonding points and support heights can be modified. This allows the same fixture to adapt to different disk-type components and machining stages by reconfiguring the bonding apparatus, thereby achieving high adaptability while maintaining relative manufacturing simplicity through modular design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces machining deformation and enhances surface shape accuracy by allowing for adjustable bonding points and stress release, enabling precise clamping and easy disassembly without damage to the workpiece.
Implementation Method 1
a bonding method adopts the low-stress adhesive to fix the workpiece on the fixture
Implementation Method 2
the planar components are firmly clamped on a fixture surface through the pressure difference between a vacuum cavity in the fixture and the atmosphere
Data Source
AI summary
The present invention discloses a flexible dot matrix bonding apparatus and an adaptive clamping method for a disk-type planar component. The apparatus mainly comprises three components: a substrate, connecting rods and an auxiliary support. The threaded holes in a circumferential array are uniformly distributed in the substrate, and the connecting rods are fixed at different circumferential positions of the substrate in a threaded connection manner, which play a role in bonding and supporting the disk-type planar component. The auxiliary support is matched with the substrate, so that a workpiece after turning can be taken out without damage. According to detection results of machining deformation of the disk-type planar component, the installation positions of the connecting rods on the substrate are adjusted accordingly, thus changing bonding positions of the disk-type planar component. Finally, an adaptive clamping method aiming at reducing the machining deformation of the disk-type planar component is formed.