Dot Matrix Transfer Head for Multi-Pitch Semiconductor Die Alignment
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Solution Overview
Problem
Conventional semiconductor device transfer mechanisms lack adaptability and precision, leading to inefficiencies and increased time in reconfiguring for different applications, resulting in larger product dimensions and higher manufacturing costs due to the need for packaging.
Innovation Solution
A direct transfer mechanism that uses a dot matrix transfer head with actuable impact wires to precisely align and transfer unpackaged semiconductor device die from a wafer tape to a product substrate without packaging, allowing for multi-pitch or matched-pitch configurations to accommodate varying die and circuit trace spacings, thereby reducing product thickness and manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging processes are used to protect semiconductor die, then device reliability is improved, but product thickness and volume increase significantly
Solution Approach 1:
The patent extracts the protective function from the traditional bulky packaging structure and implements it through a thin-film encapsulation layer deposited directly on the die surface. This allows the protective function to be maintained while eliminating the need for thick packaging materials and complex packaging structures, thereby significantly reducing product volume while maintaining device reliability
Solution Approach 2:
The patent employs thin-film encapsulation layers (such as alternating organic and inorganic thin films) to provide protection against environmental factors. These thin films replace traditional thick packaging materials, maintaining protective functionality while minimizing the increase in product thickness and volume
2Adaptability or versatility
If transfer mechanisms are reconfigured for different products, then adaptability is improved, but reconfiguration time and complexity increase
Solution Approach 1:
The patent designs a transfer mechanism with a modular pick-and-place head that can accommodate different die sizes, shapes, and pitches through interchangeable grippers and adjustable positioning systems. This universal design allows the same base mechanism to handle multiple product types without requiring complete reconfiguration, thereby reducing reconfiguration time while maintaining adaptability
Solution Approach 2:
The patent incorporates dynamically adjustable components in the transfer mechanism, including variable pitch conveyors, adjustable gripper forces, and programmable positioning systems. These dynamic elements allow the mechanism to adapt to different product specifications through software control rather than physical reconfiguration, minimizing downtime and maintaining versatility
3Manufacturing precision
If precise alignment is achieved for die transfer, then manufacturing precision is improved, but device thickness increases
Solution Approach 1:
The patent replaces traditional mechanical alignment systems with laser-based optical alignment and vision guidance systems. These non-contact measurement and positioning methods achieve high precision die alignment without requiring thick mechanical alignment structures or complex mechanical adjustment mechanisms, thereby maintaining manufacturing precision while minimizing device thickness
Data Source
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AI summary
A method for executing a direct transfer of semiconductor device die from a first substrate to transfer locations on a second substrate. The method includes determining a position of impact wires disposed on a transfer head, semiconductor device die, and transfer locations; determining whether there are at least two positions that an impact wire, a semiconductor device die, and a transfer locations are aligned within a threshold tolerance; and transferring, by the impact wires, the semiconductor device die such that the semiconductor device die detaches from the first substrate and attaches to transfer locations on the second substrate. The transferring being completed based at least in part on determining that the impact wire, the semiconductor device die, and the circuit trace are aligned within the threshold tolerance.