Dot-Pattern Substrate Support for Easy Circuit Pattern Debonding
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Solution Overview
Problem
Existing substrate support designs with adhesive layers covering the entire surface of semiconductor substrates make it difficult to pick up individual circuit patterns without damaging them, as excessive force is required for debonding.
Innovation Solution
A substrate support with a base material and an adhesive layer formed in a dot pattern on the bonding surface, allowing for low adhesion and facilitating effortless debonding of circuit patterns by reducing the force needed for pickup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive layer is formed on the entire upper surface of substrate support, then adhesion between substrate support and semiconductor substrate is increased, but picking up individual circuit patterns becomes difficult and requires excessive force
Solution Approach 1:
The adhesive layer is segmented into discrete dot patterns rather than being continuous. This segmentation reduces the total bonding area while maintaining localized adhesion points, enabling circuit patterns to be easily separated from the substrate support during pickup operations.
Solution Approach 2:
The adhesive layer is applied locally at specific dot positions rather than uniformly across the entire surface. This local quality approach creates regions of high adhesion (at dot locations) and regions of no adhesion (between dots), facilitating both secure bonding and easy separation of circuit patterns.
2Area of stationary object
If adhesive layer is formed on the entire upper surface of substrate support, then bonding area is expanded, but damage to circuit pattern during debonding increases
Solution Approach 1:
By segmenting the adhesive layer into discrete dots, the total bonding area is controlled and distributed. This reduces the cumulative adhesion force that must be overcome during debonding, thereby minimizing stress and potential damage to the circuit pattern while still providing sufficient bonding at each dot location.
Solution Approach 2:
Instead of applying adhesive over the entire surface (excessive action), adhesive is applied only at specific dot locations (partial action). This partial application provides just enough bonding area to secure the circuit pattern during processing while avoiding excessive total adhesion that would cause damage during separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient production of semiconductor devices by minimizing damage to circuit patterns during debonding and simplifying the pickup process, while maintaining reliable retention of the semiconductor substrate.
Implementation Method 1
an adhesive layer having a pattern of dots formed in at least a portion of the bonding surface
Data Source
AI summary
A substrate support that allows for effortless debonding of a circuit pattern, the substrate support including a base material having a bonding surface to which a semiconductor substrate (circuit pattern) is bonded; and an adhesive layer having a pattern of dots formed in at least a portion of the bonding surface.