Double Adhesive Layer Packaging for Carrier Separation Control

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Solution Overview

Problem

Current semiconductor packaging technologies face challenges in achieving high integration density, small form factor, and thinness while maintaining effective adhesive layer curing and carrier separation processes.

Innovation Solution

A method involving the lamination of a two-layer adhesive sheet, where the first adhesive layer is cured thermally and the second adhesive layer is photocured, allowing for the separation of the carrier from the semiconductor die after encapsulation, with specific adhesive materials and curing processes to enhance bonding and reduce positional defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a single adhesive layer is used to bond semiconductor die to carrier, then the bonding process is simple, but it is difficult to achieve both strong initial bonding and easy carrier separation

Engineering Contradiction:

Improveadhesive bonding strengthVSAvoidcarrier separation ease

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The adhesive layer is divided into two separate layers: a first adhesive layer for bonding the semiconductor die to the carrier, and a second adhesive layer for bonding the carrier to the substrate. This segmentation allows each layer to have different properties optimized for its specific function, resolving the contradiction between strong bonding and easy separation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The adhesive layers use different curing mechanisms (thermal curing for the first layer, UV curing for the second layer) with different activation energies and curing conditions. This parameter change allows the first layer to remain stable during die attachment while the second layer can be selectively cured or uncured to facilitate carrier separation when needed.

Inventive Principle:

Principle #35Parameter changes

2Ease of operation

If multiple adhesive layers are used to enable carrier separation, then carrier separation becomes possible, but the manufacturing process complexity increases

Engineering Contradiction:

Improvecarrier separation capabilityVSAvoidadhesive layer structure

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The first adhesive layer acts as an intermediary between the semiconductor die and the carrier, providing strong bonding during manufacturing while allowing for controlled separation later. Its thermal curing mechanism provides stable bonding without interfering with the UV curing of the second layer, enabling easy carrier separation when needed.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The first adhesive layer is applied and thermally cured in advance before the second adhesive layer is applied and UV cured. This preliminary action establishes a stable bond for die attachment that will not be affected by subsequent UV curing processes, simplifying the overall manufacturing sequence.

Inventive Principle:

Principle #10Preliminary action

3Strength

If thermal curing is used for the first adhesive layer, then strong bonding is achieved, but UV curing interference may occur with the second adhesive layer

Engineering Contradiction:

Improvedie-to-carrier bondingVSAvoidcuring process compatibility

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The first adhesive layer is formulated to cure thermally at temperatures and conditions that do not activate the UV-curable second adhesive layer. This parameter separation ensures that thermal curing of the first layer does not cause premature curing or interference with the second layer, maintaining reliability of both curing processes.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the manufacturing of semiconductor packages with improved integration density, reduced positional defects, and efficient carrier separation, facilitating the production of thin and compact semiconductor packages with enhanced adhesive properties.

Implementation Method 1

The first adhesive layer of the two-layer sheet is cured after the sheet is laminated to the carrier

Methodology Applied

Scientific EffectThermal curing: Heating

Implementation Method 2

the second adhesive layer is photocured

Methodology Applied

Scientific EffectPhotocuring: Photopolymerisation

Data Source

PatentUS20250022830A1Method of manufacturing semiconductor package using double adhesive layers

Publication Date: 2025.01.16 SK HYNIX INC

AI summary

First and second layers of different adhesive materials are laminated to a carrier such that the second adhesive layer is attached to the carrier. The first adhesive layer is cured first. A semiconductor die is then placed on the cured first adhesive layer. An encapsulant layer is formed over at least a portion of the cured first adhesive layer while encapsulating the first semiconductor die. The second adhesive layer is cured after which the carrier is separated from the cured second adhesive layer.