Double Ball Bump Electrical Coupling for Optoelectronic Modules
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Solution Overview
Problem
Designing and manufacturing high-density printed circuit board assemblies and optoelectronic modules with multiple integrated circuits poses challenges in electrically coupling electrical contacts in a small area while maintaining suitable performance, as increased component density leads to close proximity of components and electrical connections, increasing the likelihood of short circuits due to wire overlap and varying angles.
Innovation Solution
The use of a double ball bump configuration, where a second ball bump is positioned on the second contact pad and a third ball bump is placed over the second ball bump, provides additional spacing and clearance for wires, preventing overlap and ensuring proper operation by angling the first and second wires with respect to each other, and stitching them to the first and double ball bonds respectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If component density is increased to reduce module size, then area utilization is improved, but wire overlap and short circuit risk increase
Solution Approach 1:
The patent introduces a vertical dimension by stacking ball bumps in multiple layers (first ball bump, second ball bump, third ball bump) to provide wire clearance. This multi-layer vertical arrangement allows wires to be routed at different heights, preventing overlap and short circuits while maintaining high component density on the substrate surface.
Solution Approach 2:
The electrical connection path is segmented into multiple discrete ball bump stages (first, second, third ball bumps) rather than a single direct connection. This segmentation creates intermediate spacing points that enable wire routing clearance and prevent wire overlap while maintaining electrical connectivity between contact pads.
2Productivity
If components are positioned closer together to increase density, then area efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The multi-layer ball bump structure serves multiple functions simultaneously: it provides electrical connection, creates vertical wire clearance, enables routing at different heights, and maintains mechanical stability. This universal structure simplifies the overall manufacturing process despite the increased density, as the same ball bump formation process accomplishes multiple objectives.
3Ease of operation
If wires are routed at varying angles to connect contacts, then routing flexibility is improved, but wire overlap increases
Solution Approach 1:
The patent resolves wire overlap by utilizing the vertical dimension with multiple ball bump layers. Wires can now be routed at varying horizontal angles while maintaining separation through vertical stacking of ball bumps, allowing routing flexibility without compromising reliability.
Data Source
AI summary
In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.