Double-Barrier TIM Containment for Low-Void Semiconductor Cooling
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Solution Overview
Problem
Current thermal interface materials (TIMs) in semiconductor devices face issues with unwanted interactions with other metals or components, leading to inefficiencies and potential damage due to the flow of liquid metals beyond their intended positions, which can cause shorts or dissolve other metals, and existing containment methods do not optimize liquid metal contact or prevent voids effectively.
Innovation Solution
A double barrier system is implemented, comprising a first barrier made of dielectric materials like UV-curable acrylated urethane and a second thermally curable silicone barrier, creating a hermetic seal and containment area to prevent liquid metal TIM from interacting with other components and ensuring optimal contact between the heat generating device and the heat transferring device, thereby reducing voids and preventing oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid metal TIM is used for high thermal conductivity, then heat transfer efficiency is improved, but the liquid metal flows beyond intended positions and interacts unwantedly with other metals or components
Solution Approach 1:
The containment structure is divided into two separate barriers (first barrier and second barrier) positioned at different locations. This segmentation provides redundant containment, ensuring that even if one barrier is compromised, the liquid metal TIM remains contained and cannot reach other components.
Solution Approach 2:
Dielectric material is introduced as an intermediary substance between the liquid metal TIM and other metal components. This intermediary prevents direct contact and unwanted chemical interactions while allowing the TIM to maintain its thermal transfer function within the contained area.
2Object-affected harmful factors
If containment barriers are added to prevent liquid metal flow, then unwanted interactions are prevented, but the complexity of the device increases
Solution Approach 1:
The barriers are implemented as thin dielectric layers or films that provide effective containment while minimizing the addition of bulk material and structural complexity. These thin film barriers integrate smoothly into the existing device architecture without requiring major structural modifications.
Solution Approach 2:
The dielectric material serving as the barrier also provides additional functions such as electrical insulation and potential structural support. This multi-functionality reduces the need for separate dedicated containment structures, thereby limiting the increase in device complexity.
3Device complexity
If single barrier containment is used, then device complexity is limited, but the containment reliability is insufficient to prevent TIM leakage
Solution Approach 1:
The containment system is segmented into two separate barriers positioned at different locations around the liquid metal TIM. This segmentation creates redundant containment paths, ensuring that the TIM must breach both barriers to escape, thereby significantly improving containment reliability while maintaining reasonable structural simplicity.
Solution Approach 2:
The dual barrier system provides a cushion of protection against potential TIM leakage. Even if the first barrier is compromised, the second barrier serves as a backup containment mechanism, preventing TIM from reaching other components and maintaining system reliability.
4Manufacturing precision
If barriers are positioned close to heat generating device, then TIM contact is optimized, but the risk of TIM interaction with barriers increases
Solution Approach 1:
Dielectric material is used as an intermediary layer between the liquid metal TIM and the barrier structures. This intermediary prevents direct contact and potential chemical reactions between the TIM and barrier materials while maintaining the close positioning needed for optimal thermal contact and containment effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The double barrier system effectively contains liquid metal TIMs, preventing unwanted interactions, reducing voids, and creating a hermetic seal to enhance thermal performance and protect sensitive components from gallium-based TIMs, while maintaining efficient heat transfer.
Implementation Method 1
a second barrier surrounding the first barrier such that there is an area between the first barrier and the second barrier... the thermal interface material is hermetically sealed by the second barrier
Implementation Method 2
the first barrier comprises a UV curable, acrylated urethane
Implementation Method 3
the second barrier comprises a thermally curable silicone
Implementation Method 4
a thermal interface material between and in touching relation with the heat transferring device and a second surface of the heat generating device opposite the first surface
Data Source
AI summary
Described are a double barrier system and method used to contain a thermal interface material to avoid unwanted interactions of the thermal interface material with other metals or components within a semiconductor device. In one implementation, a semiconductor assembly includes: a substrate; a heat generating device including a first surface attached to the substrate; a first barrier surrounding and in touching relation with the heat generating device; a second barrier surrounding the first barrier such that there is an area between the first barrier and the second barrier; a heat transferring device; and a thermal interface material between and in touching relation with the heat transferring device and a second surface of the heat generating device opposite the first surface.