Double-Curing Encapsulation Composition for OLED Moisture Barriers
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Solution Overview
Problem
Organic electronic devices, particularly OLEDs, are susceptible to oxidation and moisture ingress, leading to durability issues that affect their lifespan and reliability, especially under high temperature and high humidity conditions.
Innovation Solution
An encapsulation composition comprising a non-reactive olefin-based compound and a reactive olefin-based compound, along with a moisture adsorbent, is used to form a moisture barrier that maintains shape and durability, incorporating a double-curing method to control flow and ensure effective encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a moisture adsorbent is added to the encapsulation composition to block moisture ingress, then moisture barrier performance is improved, but the encapsulation structure may peel off or be destroyed due to expansion stress when the moisture adsorbent reacts with moisture
Solution Approach 1:
The patent changes the chemical parameters of the encapsulation composition by introducing a moisture adsorbent (such as molecular sieves or calcium oxide) that reacts with moisture. This parameter change enables the composition to actively block moisture ingress while controlling the expansion stress through proper material selection and formulation ratios
Solution Approach 2:
The patent uses an intermediary substance (the moisture adsorbent) that mediates between the harmful moisture and the encapsulated organic electronic device. The moisture adsorbent absorbs moisture through chemical reaction, preventing direct contact with the device while managing the resulting volume expansion within the encapsulation structure
2Reliability
If the encapsulation composition is designed to provide excellent moisture blocking capability, then durability under high temperature and high humidity is improved, but shape retainability may be compromised
Solution Approach 1:
The patent employs a composite encapsulation composition combining multiple materials: a resin matrix (such as silicone resin or acrylic resin) that provides structural integrity and shape retainability, and a moisture adsorbent component that provides moisture blocking capability. This composite structure allows both durability and shape stability to coexist
Solution Approach 2:
The patent adjusts the physical and chemical parameters of the encapsulation composition, including the ratio of resin to moisture adsorbent, the molecular weight distribution, and the crosslinking density, to optimize both moisture barrier performance and shape retainability under severe environmental conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulation composition provides excellent moisture barrier properties, maintaining the integrity of organic electronic devices under severe conditions by preventing moisture and oxygen ingress, thus enhancing their lifespan and reliability.
Implementation Method 1
a moisture adsorbent, which is described below, in the composition for encapsulation, where the moisture adsorbent means a chemically reactive adsorbent capable of removing moisture or oxygen through a chemical reaction with the moisture or oxygen penetrated into the encapsulation structure
Implementation Method 2
the encapsulation composition can implement the shape retainability and the moisture- and heat-resistant durability under severe conditions while implementing moisture barrier performance
Data Source
AI summary
The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.