Double-Dielectric Component Carrier for Miniaturized Heat Management

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing component carrier manufacturing methods face challenges in improving productivity and heat management, particularly in achieving miniaturization and reducing manufacturing costs.

Innovation Solution

The component carrier is manufactured on a panel level instead of a wafer level, utilizing a dielectric double layer made of two different materials and through-holes filled with conductive material, allowing for enhanced productivity, miniaturization, and heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If component carrier is manufactured on wafer level, then manufacturing precision can be maintained, but productivity is low and manufacturing costs are high

Engineering Contradiction:

ImproveproductivityVSAvoidmanufacturing cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent transitions from wafer-level manufacturing to panel-level manufacturing, changing the dimensional scale of production. This allows multiple component carriers to be manufactured simultaneously on a single panel, significantly increasing productivity while maintaining manufacturing precision through the structured panel approach

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If component carrier size is reduced for miniaturization, then package volume and thickness are reduced, but heat management becomes more difficult

Engineering Contradiction:

Improvepackage volumeVSAvoidheat management

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent employs a dielectric double layer structure made of two different materials with complementary properties. One material provides mechanical support and structural integrity, while the other offers enhanced thermal conductivity, allowing heat to be efficiently conducted away from the compact package despite its reduced size

Inventive Principle:

Principle #40Composite materials

3Adaptability or versatility

If asymmetric build-up procedure is used, then manufacturing flexibility is improved, but warpage occurs during manufacturing process

Engineering Contradiction:

Improvemanufacturing flexibilityVSAvoidwarpage

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent deliberately introduces a symmetric element (the dielectric double layer with two different materials) to counterbalance the asymmetry in the build-up procedure. This symmetric structure distributes stresses evenly during manufacturing, preventing warpage while maintaining the flexibility needed for various component configurations

Inventive Principle:

Principle #4Asymmetry

Data Source

PatentUS12207399B2Component carrier having a double dielectric layer and method of manufacturing the same

Publication Date: 2025.01.21 AT&S (CHONGQING) CO LTD

AI summary

A component carrier has a stack including a plurality of electrically insulating layer structures and at least one electrically conductive layer structure, wherein two of the at least two electrically insulating layer structures form a dielectric double layer made of two different materials; a through-hole extending through the double dielectric layer; and an electrically conductive material filling at least a part of the through-hole. A method of manufacturing a component carrier is also disclosed.