Double-Encapsulated Wire Connections for Corrosion Sensors
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Solution Overview
Problem
Existing corrosion sensors for metallic materials face challenges in maintaining reliability due to fragility, inadequate corrosion proofing, and manufacturing difficulties, particularly in harsh environments, leading to issues with wire connections and sealant integrity.
Innovation Solution
The method involves encapsulating wire connections within a flexible chemical and heat-resistant sealing compound, followed by injection molding with a two-part epoxy aircraft sealant, ensuring robustness and preventing moisture ingress, while using specific sealants and coatings to enhance the seal between painted surfaces and potting compounds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire connections are exposed in standard corrosion sensors, then ease of manufacture is improved, but reliability deteriorates due to fragility and inadequate corrosion proofing in harsh environments
Solution Approach 1:
The patent implements a dual-encapsulation structure where an inner sealant (first sealing compound) encapsulates the wire connections and chip, and an outer sealant (second sealing compound) encapsulates the inner sealant. This nested arrangement provides multiple layers of protection against moisture and corrosion, significantly improving reliability while maintaining manufacturability through a systematic sealing process.
Solution Approach 2:
The patent employs composite sealing materials consisting of two different sealants with complementary properties. The inner sealant provides primary sealing and chemical resistance, while the outer sealant provides secondary protection and environmental resistance. This composite approach creates a robust multi-layer barrier that protects wire connections from harsh environments without complicating the manufacturing process.
2Ease of manufacture
If standard potting techniques are used to encapsulate wire connections, then ease of manufacture is improved, but reliability deteriorates due to sealant integrity issues and moisture ingress
Solution Approach 1:
The patent divides the encapsulation process into two distinct segmentation steps: first applying an inner sealant to encapsulate the wire connections and chip, then applying an outer sealant to encapsulate the inner sealant. This segmentation allows each sealant to be optimized for specific functions (chemical resistance for inner, environmental resistance for outer) and ensures complete coverage without voids, improving both reliability and manufacturability.
Solution Approach 2:
The patent applies the inner sealant as a preliminary action before applying the outer sealant. This preliminary encapsulation creates a protected core structure that prevents moisture and corrosive agents from reaching the wire connections, while the subsequent outer sealant provides additional environmental protection. This sequential approach ensures that each layer performs its specific protective function effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the structural integrity and reliability of corrosion sensors by preventing damage from environmental factors and ensuring consistent performance in harsh conditions, addressing the limitations of standard potting techniques and sealant issues.
Implementation Method 1
encapsulating the wire connections within a flexible chemical and heat resistant sealing compound
Implementation Method 2
subsequently, encapsulating the flexible sealing compound within a second sealing compound by an injection moulding process
Implementation Method 3
preventing moisture ingress
Data Source
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AI summary
A sensor (1) and a method of manufacturing the sensor (1), the sensor (1) including a number of metallic strips (5,6,7) mounted on a non-conducting substrate (4) and a module (3) for forming electrical connections to the strips (5,6,7) whereby to enable communication between the strips (5,6,7)and monitoring equipment for the sensor (4), the module including a number of wire connections (16), the method including the steps of encapsulating the wire connections within a flexible chemical and heat resistant sealing compound, and subsequently, encapsulating the flexible sealing compound within a second sealing compound (34) by an injection moulding process.