Double Encapsulation of Optoelectronic Components for Edge Moisture Protection

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Solution Overview

Problem

Existing encapsulation methods for optoelectronic components, particularly organic photovoltaic elements, fail to adequately protect the edges and corners from moisture and oxygen ingress, leading to reduced component lifetime due to delamination and mechanical damage.

Innovation Solution

A double encapsulation system is employed, comprising a first encapsulation with barrier layers on the front and rear faces, surrounded by a second encapsulation with protective layers, where the second encapsulation extends beyond the edges of the first, providing enhanced protection against moisture and mechanical damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single encapsulation with barrier layers is used, then the structure remains simple and cost-effective, but the edges and corners are insufficiently protected against moisture and oxygen ingress

Engineering Contradiction:
Improveprotection against moisture and oxygen ingressVSAvoidencapsulation structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements a double encapsulation system where a first encapsulation with barrier layers is surrounded by a second encapsulation with protective layers. The first encapsulation is nested within the second encapsulation, with both extending beyond the optoelectronic component edges to provide overlapping protection. This nested structure ensures that edges and corners are protected by multiple layers, preventing moisture and oxygen ingress while maintaining a systematic approach to encapsulation design.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Stability of the object's composition

If the encapsulation extends beyond the component edges to protect corners, then protection against delamination improves, but the coating process becomes more complex and corners remain vulnerable

Engineering Contradiction:
Improveresistance to delaminationVSAvoidcoating process complexity
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent applies barrier layers and protective layers that extend beyond the edges of the optoelectronic component before final assembly and sealing. By pre-extending the encapsulation layers beyond the component boundaries, the design ensures that corners and edges are covered and protected from the outset, preventing delamination and moisture ingress at critical areas before the component is fully assembled and sealed.

Inventive Principle:
Principle #10Preliminary action

3Strength

If flexible solar cells use laminates or film composites for protection, then mechanical protection is provided, but the demands on materials are high and moisture barrier requirements are stringent

Engineering Contradiction:
Improvemechanical protectionVSAvoidmoisture barrier performance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent employs a composite encapsulation system consisting of a first encapsulation with barrier layers (providing moisture and oxygen barrier) and a second encapsulation with protective layers (providing mechanical protection). This composite structure combines materials with different functions - the barrier layers offer excellent moisture and oxygen impermeability, while the protective layers provide mechanical strength and flexibility. The combination achieves both high mechanical protection and superior moisture barrier performance without requiring single materials to meet all demanding requirements simultaneously.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS12439766B2Encapsulation system for an optoelectronic component comprising at least a first encapsulation and a second encapsulation, and optoelectronic component comprising an encapsulation system of this kind
Publication Date: 2025.10.07 HELIATEK GMBH
  • US12439766B2 patent drawing
  • US12439766B2 patent drawing
  • US12439766B2 patent drawing

AI summary

An encapsulation system, including a first encapsulation formed from at least one front barrier layer on a front face of the optoelectronic component and at least one rear barrier layer on a reverse face of the optoelectronic component with at least one first connecting material disposed in between, and a second encapsulation formed from at least one front protective layer on the front face of the optoelectronic component and at least one rear protective layer on the reverse face of the optoelectronic component with at least one second connecting material disposed in between, wherein the first encapsulation surrounds the optoelectronic component such that the first encapsulation projects beyond the optoelectronic component by a first edge region, and the second encapsulation surrounds the first encapsulation comprising the optoelectronic component such that the second encapsulation projects beyond the first edge region of the first encapsulation by a second edge region.