Double-Face-Cooled Semiconductor Module for Inverter Heat Management
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Solution Overview
Problem
Conventional power conversion devices for in-vehicle systems face challenges in achieving high cooling efficiency and reliability, particularly in compact spaces with vibration exposure, where existing cooling technologies do not adequately address the heat management and reliability needs for efficient power conversion.
Innovation Solution
A double-face-cooled semiconductor module design incorporating upper and lower arms of an inverter circuit with heat dissipation members and conducting members through insulation, where the semiconductor chips are sandwiched by heat dissipation metal plates on both sides, enhancing cooling efficiency and reliability by utilizing engine cooling water and simplifying the cooling system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling structures are used with semiconductor modules, then heat dissipation can be achieved, but the cooling efficiency is insufficient and the system size increases
Solution Approach 1:
The patent combines the semiconductor module housing with the heat dissipation function by integrating cooling channels directly into the housing structure. The housing serves dual purposes: mechanical protection and thermal management, eliminating the need for separate cooling components and reducing overall system size while improving heat dissipation efficiency.
Solution Approach 2:
The housing structure is designed to perform multiple functions simultaneously: structural support, electrical insulation, and heat dissipation. The heat dissipation member integrated into the housing acts as both a mounting structure and a thermal management component, allowing the same component to serve universal purposes and reduce system complexity.
2Temperature
If semiconductor modules are cooled from one side only, then assembly is simplified, but cooling efficiency is insufficient for high power applications
Solution Approach 1:
The patent transitions from single-sided cooling to dual-sided cooling by incorporating cooling channels on both sides of the semiconductor module housing. This dimensional change in the cooling approach allows heat to be dissipated from both surfaces of the module, significantly improving cooling efficiency without requiring overly complex external cooling systems.
3Power
If the semiconductor module is designed for high power conversion, then power conversion capability increases, but heat generation and cooling requirements increase
Solution Approach 1:
The patent merges the power conversion function with integrated heat dissipation by incorporating cooling channels directly into the housing structure surrounding the semiconductor module. This integration ensures that as power conversion capability increases, the heat management capability scales proportionally, maintaining thermal performance without requiring separate cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves cooling efficiency, reduces the size of the power conversion device, enhances reliability by minimizing temperature increase and vibration resistance, and simplifies the cooling system, making it suitable for in-vehicle applications.
Implementation Method 1
heat dissipation members... sandwiched by heat dissipation metal plates on both sides... utilizing engine cooling water
Data Source
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AI summary
A double-face-cooled semiconductor module (500) with an upper arm and a lower arm of an inverter circuit (44) includes first and second heat dissipation members (522, 562), each having a heat dissipation surface on one side and a conducting member (534) formed on another side through an insulation member (524). On the conducting member (534) on the first dissipation plate is provided with a fixing portion (536) that fixes a collector surface of the semiconductor chip (538, 547) and a gate conductor connected to a gate terminal (553) of the semiconductor module. The gate electrode terminal and the gate conductor (555) are wire bonded. The conducting member on the second heat dissipation member is connected to an emitter surface of the semiconductor chip connected to the first heat dissipation member. The productivity and reliability are improved by most of formation operations for the upper and lower arms series circuit on one of the heat dissipation member.