Double-Faced Cooling Power Module Assembly Against Bonding Tilt
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Solution Overview
Problem
The existing power modules with double-faced cooling suffer from tilting issues during assembly, leading to assembly errors, excessive stress on components, and deterioration of heat dissipation performance due to uneven bonding layer solidification.
Innovation Solution
Incorporating anti-tilting members made of materials with higher melting points than the bonding material, strategically positioned within the bonding layers to support the power element and thermal-conductive members, ensuring accurate alignment and reducing thickness errors to less than 20 μm, thereby preventing tilting and stress accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If bonding material is melted and solidified to bond power element and thermal-conductive member, then bonding is achieved, but tilting occurs due to uneven solidification speed
Solution Approach 1:
A support structure is introduced as an intermediary element between the power element and thermal-conductive member. This support structure maintains proper spacing and alignment during the bonding process, preventing tilting caused by uneven solidification of the bonding material.
Solution Approach 2:
The support structure is positioned in advance before bonding material is applied. It preliminarily establishes the correct spatial relationship and alignment between components, ensuring that when bonding material is later melted and solidified, tilting does not occur.
2Temperature
If double-faced cooling structure is used to dissipate heat, then heat dissipation performance is improved, but assembly errors increase due to tilting
Solution Approach 1:
The support structure acts as a mediator that ensures precise assembly of the double-faced cooling structure. By maintaining proper spacing and preventing tilting during bonding, it enables accurate assembly of heat sinks on both surfaces while preserving heat dissipation performance.
3Ease of manufacture
If bonding layer is formed without support structure, then manufacturing process is simple, but stress concentrates on specific portions due to tilting
Solution Approach 1:
The support structure is installed before bonding to preliminarily establish uniform stress distribution. By preventing tilting during the bonding process, it ensures that stress is evenly distributed across the bonding layer rather than concentrating on specific portions, while adding minimal complexity to the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces assembly errors, minimizes stress on components, and maintains optimal heat dissipation performance by ensuring precise bonding and alignment, thus preventing damage from excessive thermal stress.
Implementation Method 1
The power element and the thermal-conductive member are bonded to each other by melting the bonding material, and then coupled to each other during the process of solidifying the bonding material again.
Data Source
AI summary
A power module according implementations of the present disclosure includes a bonding layer for bonding two adjacent members. The bonding layer is formed by melting, applying, and solidifying a bonding material that has excellent thermal conductivity and electrical conductivity. The melted bonding material includes a plurality of anti-tilting members. The two members bonded during the process of solidifying the melted bonding material are supported by the plurality of anti-tilting members. This may allow tilting caused during the formation of the bonding layer to be suppressed.