Double-Gate MFMIS-FET Structure for Higher ON Current

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Solution Overview

Problem

Ferroelectric memory devices, such as FeFET and FeRAM, face limitations due to low ON current, which affects their performance in high-speed data applications by causing slow read and write speeds.

Innovation Solution

The implementation of a double gate metal-ferroelectric-metal-insulator-semiconductor field-effect transistor (MFMIS-FET) structure, which includes a lower and upper gate electrode to control the polarization state of ferroelectric structures, resulting in a higher ON current and improved conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a conventional single gate ferroelectric FET structure is used, then the device structure is simple, but the ON current is low resulting in slow read and write speeds

Engineering Contradiction:
Improveread and write speedsVSAvoidtransistor structure complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The gate structure is segmented into two separate gates (first gate electrode and second gate electrode) positioned on opposite sides of the channel. This segmentation allows independent control of the channel from both sides, enabling enhanced carrier injection and higher ON current compared to a single gate structure, thereby improving read and write speeds.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a single-plane gate control to a three-dimensional dual-gate configuration where gates are positioned on opposite sides of the channel. This dimensional change enables simultaneous control of the channel from both top and bottom, creating a more effective electric field distribution and improving carrier transport efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Power

If a double gate MFMIS-FET structure is implemented, then the ON current is enhanced, but the device structure becomes more complex

Engineering Contradiction:
ImproveON currentVSAvoidtransistor structure complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The invention combines two gate structures into a single integrated device, where both gates work synergistically to control the channel. The first and second gate electrodes are merged into one functional unit that provides coordinated control, enabling enhanced ON current through combined electric field effects while maintaining a unified device architecture.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The dual gate structure provides multi-functional control capabilities, where each gate can independently or jointly control the channel conductivity. This multi-functionality allows the device to achieve higher ON current states while maintaining the ability to operate in different modes, effectively utilizing the additional structural complexity for enhanced performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The double gate MFMIS-FET structure enhances the ON current, thereby improving the performance of ferroelectric memory devices by increasing their speed and expanding their applicability to high-speed data applications.

Implementation Method 1

Some promising candidates for next generation memory technology utilize ferroelectricity to store data, such as ferroelectric field-effect transistor (FeFET) memory

Methodology Applied
Scientific EffectFerroelectricity:

Implementation Method 2

a lower and upper gate electrode to control the polarization state of ferroelectric structures

Methodology Applied
Scientific EffectElectric field control of polarization: Electric Field

Data Source

PatentUS12150309B2Double gate metal-ferroelectric-metal-insulator-semiconductor field-effect transistor (MFMIS-FET) structure
Publication Date: 2024.11.19 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12150309B2 patent drawing
  • US12150309B2 patent drawing
  • US12150309B2 patent drawing

AI summary

Various embodiments of the present disclosure are directed towards an integrated chip (IC) comprising a lower gate electrode disposed in a dielectric structure. A first ferroelectric structure overlies the lower gate electrode. A first floating electrode structure overlies the first ferroelectric structure. A channel structure overlies the first floating electrode structure. A second floating electrode structure overlies the channel structure. A second ferroelectric structure overlies the second floating electrode structure. An upper gate electrode overlies the second ferroelectric structure.