Double Insulated Heat Spreader for High-Voltage Thermal Management
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Solution Overview
Problem
High-voltage electronic devices face challenges in efficient thermal management due to heat dissipation, particularly in power converters, high-intensity LED light fixtures, and photovoltaic modules, where existing solutions often require complex and costly grounding and single insulation layers, leading to inefficiencies and increased production costs.
Innovation Solution
A double-insulated heat spreader system comprising a primary heat spreader within an enclosure and a secondary heat spreader on the exterior, combined with multiple insulation layers and a polymer enclosure, allowing for efficient heat dissipation and reduced moisture ingress, eliminating the need for grounding and simplifying manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single insulation layer with grounding is used in heat spreader systems, then electrical safety is achieved, but device complexity and production cost increase
Solution Approach 1:
The heat spreader system is segmented into distinct functional layers: a first heat spreader layer for thermal management and a second heat spreader layer electrically isolated from the first layer. This segmentation allows the system to achieve electrical safety through physical separation and insulation between layers, eliminating the need for external grounding while maintaining safety standards.
Solution Approach 2:
An insulation layer is introduced as an intermediary element between the first and second heat spreader layers. This intermediate insulation layer provides electrical isolation, allowing the system to achieve the same safety function as grounding would provide, but through a passive insulating barrier rather than an active grounding connection.
2Ease of manufacture
If a single insulation layer is used in heat spreader systems, then manufacturing is simpler, but moisture resistance and thermal management efficiency deteriorate
Solution Approach 1:
The insulation system is segmented into multiple distinct insulation layers positioned between the heat spreader layers. This multi-layer segmentation creates multiple barriers to moisture ingress while maintaining relatively simple manufacturing processes for each individual layer, achieving both moisture resistance and ease of manufacture.
Solution Approach 2:
The system employs composite construction with different material layers serving different functions: thermal conductive layers for heat management and insulating layers for moisture and electrical protection. This composite approach allows each layer to be optimized for its specific function while working together as an integrated system.
3Reliability
If complex grounding systems are implemented, then electrical safety is improved, but production cost increases
Solution Approach 1:
The grounding requirement is extracted and eliminated from the system by implementing complete electrical isolation between heat spreader layers through insulation. Instead of requiring external grounding connections and associated cost, the system achieves safety through self-contained insulation, removing the need for grounding infrastructure.
Solution Approach 2:
The solution replaces expensive grounding systems with simpler, cheaper insulating materials that provide equivalent safety functionality. The insulation layers use cost-effective materials that achieve the same protective effect as complex grounding systems would, significantly reducing production costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The double-insulated heat spreader system effectively manages thermal issues in high-voltage devices, reducing stress on PCBs, lowering production costs, and enhancing moisture resistance, while maintaining a double insulation rating without the need for grounding, thus improving overall thermal management and device reliability.
Implementation Method 1
a first heat spreader layer coupled to a printed circuit board and comprising a first material
Implementation Method 2
reducing stress on PCBs, lowering production costs, and enhancing moisture resistance
Implementation Method 3
a second heat spreader layer disposed outside the enclosure and comprising a second material
Data Source
AI summary
An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.