Double-Layer Hermetic Encapsulation for Smaller Implants
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing implantable electronic devices face challenges in hermetic packaging that protect against bodily fluids and corrosion while minimizing device size and ensuring reliable function, as prior methods often result in larger implants with increased wound healing and tissue irritation risks.
Innovation Solution
A method involving a double-layer encapsulation structure, with overlapping top and bottom layers covering the electronic component's side walls, providing a hermetic seal that minimizes interaction with the in vivo environment and prevents corrosion, using biocompatible and corrosion-resistant materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic devices are packaged in metal housings to protect against bodily fluids and corrosion, then hermetic sealing and device protection are improved, but device size increases leading to larger incisions and extended wound healing
Solution Approach 1:
The patent applies thin film encapsulation layers (such as aluminum oxide, titanium oxide, or other corrosion-resistant materials) deposited directly onto the electronic device surfaces. These thin protective films provide hermetic sealing without requiring bulky metal housings, thereby maintaining small device size while ensuring protection against bodily fluids and corrosion.
Solution Approach 2:
The patent employs composite encapsulation structures combining multiple material layers with different properties. For example, combining corrosion-resistant ceramic coatings with biocompatible polymer layers creates a composite protective structure that provides both hermetic sealing and biological compatibility, eliminating the need for large metal housings.
2Reliability
If larger metal housings are used for packaging, then hermetic protection is improved, but wound healing time and tissue irritation increase
Solution Approach 1:
By using thin film encapsulation instead of large metal housings, the device maintains a small footprint that minimizes tissue disruption during implantation. The thin protective films provide adequate protection against bodily fluids without requiring extensive incisions, thereby reducing wound healing time and tissue irritation.
3Reliability
If individual packaging of each electronic device is performed, then hermetic sealing is ensured, but manufacturing complexity and processing time increase
Solution Approach 1:
The patent employs batch processing techniques where multiple electronic devices are packaged simultaneously using conformal coating methods. The encapsulation materials are deposited over entire substrates containing multiple devices, creating hermetic seals for all devices in one manufacturing run, thereby reducing manufacturing complexity and processing time compared to individual packaging.
4Productivity
If packaging is performed before clean room conditions, then manufacturing efficiency is improved, but contamination and damage risk increase
Solution Approach 1:
The patent performs encapsulation processing within clean room environments from the outset of manufacturing. By establishing clean room conditions before beginning the packaging process, the method prevents contamination and damage to the electronic devices and encapsulation materials, ensuring device cleanliness without sacrificing manufacturing efficiency through subsequent rework or cleaning steps.
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E~1F
AI summary
The present invention relates to the field of electronic devices, in particular implantable electronic devices, e.g. for bio-medical applications, and more particularly, to hermetically packaged electronic devices for bio-medical in vivo applications and packaging methods for such electronic devices.