Double-Layer Planar Phase Modulation Device Structure

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing phase modulation devices have complex structures and high manufacturing costs due to their multi-layer configurations, limiting their performance and flexibility.

Innovation Solution

A double-layer planar phase modulation device with a simplified structure, comprising an upper and lower patch of similar shape, connected via conductive members and an insulating dielectric layer, which enhances phase modulation range and flexibility while reducing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a multi-layer structure is adopted for phase modulation device, then the phase modulation capability is improved, but the device complexity and manufacturing cost increase

Engineering Contradiction:
Improvephase modulation capabilityVSAvoidstructure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the functions of multiple traditional layers into a simplified double-layer configuration. The upper and lower patches together with the dielectric layer and conductive members integrate the phase modulation functionality that previously required more complex multi-layer structures, thereby reducing device complexity while maintaining phase modulation capability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from conventional planar single-layer or multi-layer structures to a three-dimensional double-layer configuration with vertical stacking. The upper and lower patches are positioned at different heights with conductive members providing vertical electrical connection, utilizing the third dimension (height) to achieve phase modulation with simpler overall structure

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If a multi-layer structure is adopted for phase modulation device, then the phase modulation capability is improved, but the manufacturing cost increases

Engineering Contradiction:
Improvephase modulation capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple functional layers into a streamlined double-layer structure, reducing the number of manufacturing steps, materials required, and assembly operations. The upper patch, lower patch, dielectric layer, and conductive members form an integrated structure that is easier and less costly to manufacture compared to traditional multi-layer devices

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If a simplified structure is adopted, then the manufacturing cost is reduced, but the phase modulation range is limited

Engineering Contradiction:
Improvemanufacturing costVSAvoidphase modulation range
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent achieves extended phase modulation range in the simplified double-layer structure by utilizing vertical stacking and three-dimensional spatial arrangement. The upper and lower patches positioned at different heights with conductive members provide additional degrees of freedom for phase control, enabling broader phase modulation range despite the reduced number of layers

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10193232B2Double-layer planar phase modulation device
Publication Date: 2019.01.29 TSINGHUA UNIVERSITY
  • US10193232B2 patent drawing
  • US10193232B2 patent drawing
  • US10193232B2 patent drawing

AI summary

The present disclosure provides a double-layer planar phase modulation device. The double-layer planar phase modulation device includes an upper patch; and a lower patch, disposed opposite to the upper patch, in which a shape of the lower patch is similar to that of the upper patch, and the lower patch is electrically connected with the upper patch.