Double-Layer Storage Module Positioning for High-Density SSD Stacking

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Solution Overview

Problem

Existing storage modules in servers and industrial computers can only accommodate a single solid-state drive card, limiting the storage capacity in limited space, and existing solutions do not efficiently utilize the available space for high-density storage.

Innovation Solution

A storage module double-layer positioning device set with staggered positioning devices on both sides of the circuit board, featuring a base, retaining member, elastic member, and sliding shaft, allowing for high-density stacked storage by arranging interface cards on upper and lower layers and reducing plated through holes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a storage module is designed to accommodate only one solid-state drive card, then the structure is simple, but the storage capacity in limited space is insufficient

Engineering Contradiction:
Improvestorage capacityVSAvoidmodule structure
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent transitions from a single-layer storage configuration to a double-layer stacked configuration by utilizing the vertical dimension. Interface cards are arranged on both the upper and lower sides of the circuit board, effectively doubling the storage capacity within the same footprint area. This dimensional change resolves the contradiction by increasing storage capacity without proportionally increasing device complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The storage module is segmented into two independent interface cards (upper and lower layers), each capable of holding a solid-state drive. This segmentation allows the system to accommodate multiple storage devices while maintaining modular architecture, thus increasing storage capacity without creating a monolithic complex structure.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If interface cards are arranged in a single layer, then the circuit layout is simple, but the storage density is low

Engineering Contradiction:
Improvestorage densityVSAvoidcircuit layout
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The circuit layout extends from a single-plane configuration to a dual-plane configuration by placing electrical connectors and circuit traces on both sides of the circuit board. This allows interface cards to be positioned on upper and lower layers, doubling the storage density while managing circuit complexity through symmetrical design.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent combines the functionality of two interface cards into a single storage module unit. By merging the upper and lower interface card configurations into one integrated module, the system achieves high storage density while presenting a unified interface to the host system, thereby managing circuit complexity.

Inventive Principle:
Principle #5Merging (Combining)

3Quantity of substance

If multiple solid-state drive cards are installed in limited space, then the storage capacity increases, but the stability and positioning accuracy decrease

Engineering Contradiction:
Improvenumber of solid-state drive cardsVSAvoidpositioning accuracy
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

Positioning devices with positioning blocks act as intermediaries between the interface cards and the circuit board. These positioning blocks fit into corresponding positioning grooves on the circuit board, providing precise mechanical alignment and stable positioning for multiple solid-state drive cards installed in limited space, thereby maintaining reliability despite increased density.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Ease of manufacture

If plated through holes are used for circuit connections on both sides of the circuit board, then the electrical connectivity is achieved, but the manufacturing cost and circuit complexity increase

Engineering Contradiction:
Improvemanufacturing costVSAvoidcircuit complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent extracts the electrical connection function from traditional plated through holes and implements it through surface-mounted electrical connectors on both sides of the circuit board. This extraction eliminates the need for complex plated through hole fabrication processes, reducing manufacturing cost and circuit complexity while maintaining electrical connectivity between upper and lower interface cards.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS12550266B2Storage module double-layer positioning device set
Publication Date: 2026.02.10 HANWIT PRECISION IND LTD
  • US12550266B2 patent drawing
  • US12550266B2 patent drawing
  • US12550266B2 patent drawing

AI summary

A storage module double-layer positioning device set includes a storage module and two positioning devices arranged on two sides of the circuit board of the storage module in a staggered manner. Each positioning device includes a base with an accommodating chamber, two slideways, two side guide plates, a limiting groove, a blocking wall, a positioning block and a positioning unit; a retaining member having a horizontal portion with a pushing portion and an operating portion, a vertical portion extending inserted into the accommodating chamber, a connecting plate connected to the vertical portion, and two positioning blocks respectively inserted into the limiting grooves of the base to form positioning; an elastic member set in the accommodating chamber and stopped between the vertical portion and the blocking wall; and a sliding shaft running through the connecting plate and the elastic member with two opposite ends thereof respectively positioned in the two slideways.