Double Nozzle Substrate Cleaning Method
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Solution Overview
Problem
Current substrate cleaning methods after chemical mechanical polishing processes are inefficient in removing particles from semiconductor substrates, leading to suboptimal surface cleanliness and potential defects in semiconductor devices.
Innovation Solution
A substrate cleaning method utilizing a double nozzle system, where a high-pressure nozzle provides a deionized water spray and a low-pressure nozzle delivers a chemical solution, spaced 7 cm to 12 cm apart, with varying speeds and flow rates to target the center and edge regions of the substrate, enhancing particle removal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional single nozzle cleaning method is used, then the device complexity is low, but the particle removal efficiency is insufficient
Solution Approach 1:
The cleaning system is divided into two separate nozzles: a first nozzle for providing chemical solution and a second nozzle for providing spray. This segmentation allows each nozzle to be optimized for its specific function, with the chemical solution nozzle delivering cleaning chemistry and the spray nozzle providing high-velocity fluid impact, thereby improving overall particle removal efficiency while maintaining manageable system complexity through functional division
2Productivity
If the chemical solution and spray are provided close together, then the cleaning solution concentration remains high, but the spray cannot effectively remove particles due to insufficient diffusion space
Solution Approach 1:
The system maintains continuous useful action by having the chemical solution nozzle and spray nozzle operate in close proximity but with optimized spacing (7-12 cm). The chemical solution is continuously supplied to dissolve particles, while the spray continuously impacts the surface to remove dissolved particles and excess solution. This continuous dual-action process ensures high particle removal efficiency without requiring excessive distance between nozzles, as each component complements the other's function
3Loss of time
If the nozzle moves at high speed across the substrate, then the processing time is reduced, but the cleaning solution thickness becomes non-uniform especially at edge regions
Solution Approach 1:
The system employs dynamic control of the nozzle movement speed based on the substrate region being cleaned. The control unit adjusts the moving speed of the nozzle assembly according to the location: slower speeds are used when the nozzle is over edge regions to allow adequate time for chemical solution penetration and particle removal, while faster speeds are permitted over center regions where uniform coverage is more easily achieved. This dynamic speed adjustment maintains cleaning solution thickness uniformity across the entire substrate while minimizing overall processing time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly improves particle removal efficiency, achieving up to 100% efficiency when the nozzles are spaced 7.5 cm apart, ensuring uniform cleaning and reducing the thickness difference of the cleaning solution, thereby enhancing the cleanliness and quality of semiconductor substrates.
Implementation Method 1
a high-pressure nozzle configured to provide a spray
Implementation Method 2
a low-pressure nozzle configured to provide a chemical solution
Implementation Method 3
the chemical solution being diluted with the deionized water
Data Source
AI summary
A method of processing a substrate may include preparing the substrate, polishing the substrate, and cleaning the substrate using a double nozzle, which is configured to provide a spray and a chemical solution onto the substrate. The spray may include a deionized water, and the chemical solution may be diluted with the deionized water. The chemical solution and the spray may be spaced apart from each other by a distance of 7 cm to 12 cm.