Double Oven Circuit Board Mounting for Thermal Isolation
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Solution Overview
Problem
In double oven appliances, circuit boards stored in the gap between the upper and lower ovens are prone to overheating due to inadequate cooling, as the bottom surface absorbs thermal energy from the lower oven while the cooling medium only flows across the top surface, leading to potential damage.
Innovation Solution
A bracket with a mounting platform and support members is positioned within the gap, spacing the circuit board from the top wall of the lower oven, and a dielectric material is used between the support members and the oven wall to reduce heat transfer, along with a cooling medium flowing across the circuit board to enhance cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the circuit board is mounted directly to the top wall of the lower oven, then the device complexity is reduced, but the circuit board overheats due to thermal energy absorption from the lower oven
Solution Approach 1:
The mounting structure is segmented into multiple components: a bracket with mounting platform, support members, and dielectric material layers. This segmentation allows each component to perform a specific function - structural support, spacing, and thermal isolation - thereby reducing the circuit board temperature while maintaining manageable overall complexity
Solution Approach 2:
Dielectric material is introduced as an intermediary substance between the circuit board and the lower oven wall. This intermediary layer provides thermal isolation, preventing direct heat transfer from the lower oven to the circuit board, thus solving the overheating problem without requiring complex active cooling systems
2Ease of operation
If the cooling medium only flows across the top surface of the circuit board, then the ease of operation is improved, but the cooling effectiveness is insufficient due to thermal energy absorbed through the bottom surface
Solution Approach 1:
Thermal isolation properties are applied locally at the critical interface between the circuit board bottom surface and the lower oven wall. The dielectric material is specifically positioned where heat transfer occurs, providing targeted thermal management without requiring complex modifications to the overall cooling system operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces or eliminates excess heating of circuit boards, preventing overheating and potential damage by ensuring comprehensive cooling of the circuit boards.
Implementation Method 1
a dielectric material is positioned between top wall of the lower oven and each of the plurality of support members along the vertical direction
Implementation Method 2
a cooling medium is blown across a top surface of the circuit board
Data Source
AI summary
A double oven appliance having an upper and lower oven positioned below the upper oven along a vertical direction such that a gap is defined between a top wall of the lower oven and a bottom wall of the upper oven. A bracket having a mounting platform positioned within the gap and spaced from the top wall of the lower oven along the vertical direction. The double oven appliance further including a circuit board coupled to the mounting platform such that the circuit board may be spaced from the top wall of the lower oven along the vertical direction. Further, the circuit board may be cooled by a cooling medium flowing across the circuit board.