Double-Packaged Resonator for Uniform Temperature Stabilization
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Solution Overview
Problem
In existing resonator devices, such as oven-controlled crystal oscillators, heat from a heat generating element is not uniformly transferred to the resonator element, leading to temperature differences and reduced accuracy of oscillation frequency stabilization.
Innovation Solution
A double package structure is implemented, where a first package with a base substrate made of single crystal silicon contains the resonator element, a temperature sensor circuit, and a heater circuit, and is accommodated within a second package with lower thermal conductivity, allowing for efficient heat transfer and temperature control, and a lid is bonded to create an internal space for stable temperature maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If one end of the resonator element is coupled to the heat generating element, then the resonator element can be heated for temperature stabilization, but heat is not uniformly transferred to the entire resonator element, causing temperature differences and deteriorating oscillation frequency accuracy
Solution Approach 1:
A lid is introduced as an intermediary component between the heat generating element and the resonator element. The lid receives heat from the heat generating element and uniformly radiates it to the resonator element, ensuring uniform temperature distribution and eliminating temperature differences that would degrade oscillation frequency accuracy.
Solution Approach 2:
The heating approach is changed from direct one-dimensional contact heating to three-dimensional radiant heating. The lid acts as a radiant heat source that emits heat in multiple directions, enabling uniform heating of the resonator element from all sides rather than from a single point of contact.
2Reliability
If a lid is bonded to the base substrate to create an internal space, then the resonator element is enclosed for stable temperature maintenance, but the device complexity increases
Solution Approach 1:
Multiple functions are merged into the lid component: it serves as a structural enclosure to protect the resonator element, a heat radiation surface for uniform temperature distribution, and part of the sealing structure for the internal space. This integration achieves reliable temperature control without proportionally increasing device complexity.
Solution Approach 2:
The lid is designed as a multi-functional component that simultaneously provides mechanical protection, thermal management through radiation, and environmental sealing. This universal design allows a single component to fulfill multiple roles, maintaining reliability while limiting the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform heating of the resonator element, enhances temperature control accuracy, and improves the stability and precision of oscillation frequency output by reducing thermal stress and external temperature variations.
Implementation Method 1
a heater circuit
Implementation Method 2
heat of the heat generating element to be uniformly transferred to the entire resonator element
Implementation Method 3
a temperature sensor circuit
Implementation Method 4
a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate
Data Source
AI summary
A resonator device includes: a resonator element; a first package that accommodates the resonator element; and a second package in which the first package is accommodated and fixed. The first package includes a base substrate that has a first surface on which the resonator element is disposed and a second surface which is in a front-back relationship with the first surface, and that contains single crystal silicon, an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor circuit and a heater circuit, and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.