Semiconductor Waste-Gas Reactor With Double-Pipe Water Reservoir
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Solution Overview
Problem
Existing scrubber facilities face issues with powder emissions from combustion by-products, which can lead to operational shutdowns and non-uniform water films on inner surfaces, affecting the efficiency and reliability of semiconductor manufacturing facilities.
Innovation Solution
A reactor apparatus with a double-pipe water reservoir structure and a cover member featuring bumps and guide blocks to form a uniform water film, preventing powder accumulation and ensuring smooth water flow, thereby reducing the risk of burner extinguishment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water flows through the double pipe structure, then cooling effect is provided, but non-uniform water film forms on inner surface
Solution Approach 1:
The patent applies local quality by providing protrusions at specific locations on the inner wall of the water reservoir. These protrusions create localized water film formation zones, ensuring uniform water distribution exactly where needed on the inner surface, thereby resolving the non-uniform water film issue while maintaining the cooling function.
2Productivity
If combustion is performed in the reactor, then waste gas is treated, but powder emissions are generated
Solution Approach 1:
The patent converts the harmful powder emissions into beneficial water-soluble compounds by introducing water through the double pipe structure. The water absorbs the powder particles, transforming the harmful combustion byproducts into a manageable aqueous phase that can be easily removed and treated, thus converting harm into benefit.
3Power
If powder accumulates on the burner, then combustion efficiency decreases, but facility shutdown occurs
Solution Approach 1:
The patent applies preliminary action by continuously supplying water through the double pipe structure before powder accumulation can occur on the burner. This preventive water supply creates a protective water film that stops powder particles from settling on the burner surface, thereby preventing combustion efficiency degradation and avoiding facility shutdowns.
4Productivity
If treatment liquid is introduced through inlet, then by-products are removed, but powder emissions occur
Solution Approach 1:
The patent introduces water as an intermediary substance through the double pipe structure. This water acts as a mediator between the treatment liquid and the powder particles, facilitating the dissolution and removal of powder emissions by converting them into a water-soluble form that can be efficiently transported out of the reactor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances the uniformity of water films on inner surfaces, reducing powder accumulation and extinguishment risks, ensuring continuous operation and improved efficiency in semiconductor manufacturing processes.
Implementation Method 1
a plurality of bumps are on a bottom surface of the cover member spaced apart from each other in a circumferential direction, the plurality of bumps configured to form a gap of several hundred μm being between the bottom surface of the cover member and an upper surface of the inner wall portion of the water reservoir
Implementation Method 2
a burner at a lower end portion of the reactor chamber to burn waste gas
Data Source
AI summary
A reactor apparatus, includes: a reactor chamber having an inlet through which treatment liquid containing by-products is introduced and having an interior space; a burner at a lower end portion of the reactor chamber to burn waste gas; a guide member above the burner and configured to allow the treatment liquid to flow outwardly of the burner; a water reservoir between the burner and the guide member, the water reservoir having a double pipe structure having an inner wall portion and an outer wall portion, and through which water supplied through a water inlet is configured to flow between the inner wall portion and the outer wall portion; and a cover member coupled to an upper end portion of the water reservoir and configured to cover a space between the inner wall portion and the outer wall portion, wherein an upper end of the outer wall portion is above an upper end of the inner wall portion, wherein a plurality of bumps are on a bottom surface of the cover member spaced apart from each other in a circumferential direction, the plurality of bumps configured to form a gap of several hundred μm between the bottom surface of the cover member and an upper surface of the inner wall portion of the water reservoir.