Double Recess Fibrous Substrate for Electronic Module Integration
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Solution Overview
Problem
The integration of a chip and antenna into a fibrous support for passport covers poses challenges due to protrusions and inadequate protection, with existing methods resulting in burrs and uneven surfaces, and the chip being vulnerable to damage.
Innovation Solution
A method involving the formation of a double recess in the support using a compression device and a milling device to create a cavity that accommodates the module, minimizing burrs and ensuring the chip and antenna are securely positioned and protected.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a cavity is made by milling with a cutter whose dimensions are slightly greater than the chip dimensions, then the chip can be integrated into the support, but burrs and residues of material are created that remain attached to the support and cause surface non-homogeneity
Solution Approach 1:
The cavity formation process is segmented into two distinct operations: first forming a larger first cavity to receive the antenna, then forming a smaller second cavity within the first cavity to receive the chip. This segmentation allows each cavity to be optimized for its specific component, preventing burr generation on the final chip cavity while still providing secure integration.
Solution Approach 2:
The first cavity is formed in advance to receive the antenna, creating a prepared environment before the chip cavity is formed. This preliminary action allows the second cavity to be formed within already-compressed material, reducing burr generation and improving surface homogeneity.
2Object-affected harmful factors
If the chip is placed on the surface of the support and covered with protective layer, then the chip is protected, but the chip remains vulnerable to shock damage and creates a protrusion that affects cover thickness homogeneity
Solution Approach 1:
The chip is nested within a second cavity that is itself located within the first cavity structure. This nested configuration allows the chip to be fully integrated into the support thickness, eliminating protrusions and ensuring homogeneous cover thickness while providing protection through the surrounding support material and protective layer.
3Ease of manufacture
If screen printing is used to produce the antenna on the support surface, then the antenna can be created, but the antenna and chip create a protrusion that affects the homogeneity of the cover thickness
Solution Approach 1:
The antenna is extracted from the traditional screen-printed surface configuration and is instead formed within a dedicated first cavity in the support. This extraction allows the antenna to be integrated into the support thickness rather than protruding from it, eliminating the thickness homogeneity problem while maintaining ease of manufacture through the cavity formation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the secure integration of a module with a chip and antenna, enhancing the homogeneity of the surface, reducing the risk of damage, and eliminating the need for screen printing the antenna, thereby improving the manufacturing process and protection of the module.
Implementation Method 1
forming a first recess by means of a first device, the first recess being defined by a contour C1 and by a depth p1, the first recess being shaped to receive the antenna of the module, the first device being a compression device
Data Source
Figure 1~2
Figure 3a~3d
Figure 3e~4
AI summary
The invention relates to a method for forming a double recess (12, 14) in a fibrous substrate (10), the double recess (12, 14) including a first and second recess, the double recess being shaped so as to receive a module consisting of at least one antenna and one chip, the method including the following steps: forming a first recess (12) using a first device, the first recess (12), which is defined by given a outline and depth, being shaped so as to receive the antenna of the module, the first device being a compression device including a presser foot; and forming a second recess (14) using a second device (40), the second recess (14), defined by a given outline and depth (p2), being shaped so as to receive the chip (14) of the module (10), the second recess (14) being formed within the outline of the first recess (12).