Double-Resin Semiconductor Packaging for Moisture Resistance
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Solution Overview
Problem
Existing semiconductor devices with a single resin layer on the upper side are susceptible to moisture ingress, compromising their reliability.
Innovation Solution
A semiconductor device design that incorporates a first resin body sealing the semiconductor element and a second resin body, with the first resin body being tightly sealed by the second, enhancing moisture resistance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single resin layer is used to seal the semiconductor element, then the device structure is simple and manufacturing is easier, but moisture can enter the resin layer and compromise reliability
Solution Approach 1:
The sealing resin is divided into two distinct layers: a first resin layer that directly seals the semiconductor element, and a second resin layer that seals the first resin layer. This segmentation creates a double-sealed structure where each layer performs a specific sealing function, preventing moisture ingress while maintaining structural integrity
Solution Approach 2:
The first resin layer is nested within the second resin layer, forming a concentric sealing structure. The second resin layer acts as an outer protective shell that encapsulates the first resin layer and semiconductor element, creating a multi-level defense against moisture penetration
2Reliability
If a single resin layer is used, then manufacturing process is simpler and faster, but the semiconductor element is not double-sealed allowing moisture ingress
Solution Approach 1:
The first resin layer is formed and cured completely before the second resin layer is applied. This preliminary action ensures that the inner sealing layer is fully stabilized and free of defects before the outer layer is added, preventing moisture pathways that could form during simultaneous curing
Solution Approach 2:
The first resin layer serves as an intermediary sealing barrier between the semiconductor element and the second resin layer. This intermediate layer provides a transition zone that enhances the overall sealing effectiveness, creating multiple interfaces that moisture must penetrate
3Reliability
If the upper side of the semiconductor element is sealed with only one resin layer, then material usage is reduced and cost is lower, but moisture in the air can enter the resin layer
Solution Approach 1:
The two resin layers are formulated with different local qualities optimized for their specific functions. The first resin layer has properties optimized for direct contact with the semiconductor element, while the second resin layer has properties optimized for external environmental resistance, creating a functionally differentiated sealing system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The double-sealed structure significantly improves moisture uptake resistance and reliability, including power cycle tolerance, by using resin materials with appropriate thermal expansion coefficients and stress-relaxing properties.
Implementation Method 1
resin materials with appropriate thermal expansion coefficients and stress-relaxing properties
Data Source
AI summary
An object is to provide a technique that improves the moisture uptake resistance of a semiconductor device. A semiconductor device includes a resin insulating sheet, a heat spreader provided on the resin insulating sheet, a semiconductor element mounted on the heat spreader, a lead frame having one end portion thereof connected to the semiconductor element, a first resin body that seals the resin insulating sheet, the heat spreader, the semiconductor element, and the one end portion of the lead frame with a rear surface of the resin insulating sheet being exposed, and a second resin body that seals the first resin body with the rear surface of the resin insulating sheet being exposed.