Double-seal ring structures for scalable semiconductor wafer circuits

The seal ring structure is divided into multiple segments rather than forming a complete continuous ring. This segmentation allows the structure to prevent crack propagation while reducing the amount of material required and simplifying the fabrication process. The segmented seal rings can be formed using standard interconnect layers without requiring additional processing steps.

The seal ring structure extends through multiple vertical layers of the wafer, utilizing the third dimension to provide crack prevention. By distributing the seal structure across multiple layers rather than concentrating it in a single plane, the patent achieves effective crack containment while maintaining compatibility with existing multi-layer interconnect architectures.

The seal ring structure serves multiple functions simultaneously: it prevents crack propagation during dicing, provides electrical isolation between adjacent devices, and can serve as part of the interconnect architecture. This multi-functionality eliminates the need for separate dedicated seal ring processing steps, as the same structures perform multiple roles in the device architecture.

The seal ring structures are merged with the existing interconnect layers and device structures. Rather than adding separate seal ring layers, the patent integrates the seal function into the existing multi-layer interconnect architecture, using conductive and dielectric materials that are already part of the standard fabrication process.

The wafer is divided into multiple independently-supported device regions separated by segmented seal rings. This segmentation allows adjacent devices to be electrically interconnected for scaling while each device maintains its own crack containment zone. The segmented structure prevents cracks from one device from propagating to neighboring devices, enabling reliable wafer-level interconnection.

The seal ring structures act as intermediary elements between adjacent devices, providing both electrical isolation and mechanical support. These intermediary structures allow devices to be electrically connected through controlled interconnect paths while physically isolating them to prevent crack propagation, thus enabling scaling without compromising reliability.