Double-shaft Shielding Device for Thin-film Deposition
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Solution Overview
Problem
During the cleaning process of thin-film-deposition equipment, pollutant particles can contaminate the substrate carrier, and existing methods lack effective shielding to prevent this contamination.
Innovation Solution
A double-shaft shielding device with two shield members that rotate and swing in opposite angular directions to switch between a shielding state and an open state, covering the substrate carrier to prevent pollutant particles from reaching it during cleaning, while avoiding contact to prevent wear-off particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the substrate carrier is extracted or kept out during cleaning, then the carrier can be protected from pollutant contamination, but the cleaning process becomes more complex and time-consuming
Solution Approach 1:
A shielding device is introduced as an intermediary component between the pollutant source (chamber walls and target material) and the substrate carrier. This shield physically blocks pollutant particles from reaching the carrier during cleaning, eliminating the need to extract the carrier while maintaining protection.
Solution Approach 2:
The shielding device is divided into multiple segments or panels that can be independently positioned and adjusted. This segmentation allows the shield to adapt to different cleaning scenarios and chamber configurations, simplifying the overall cleaning process while providing effective protection.
2Object-affected harmful factors
If a single large shield is used to cover the substrate carrier, then protection is effective, but the device complexity and space requirements increase
Solution Approach 1:
The shield is divided into multiple smaller panels or segments that can be independently positioned around the substrate carrier. These segmented shields work together to provide complete coverage while reducing the complexity of manufacturing, installing, and adjusting a single large shield.
Solution Approach 2:
The shield segments are designed to be movable and adjustable rather than fixed, allowing them to be dynamically positioned to match the substrate carrier's location and orientation. This dynamic configuration provides effective protection while simplifying the overall structure.
3Object-affected harmful factors
If the shield members are made to contact each other for complete coverage, then shielding effectiveness is improved, but wear-off particles may be generated
Solution Approach 1:
The shield members are positioned to overlap slightly or maintain minimal spacing, providing more than sufficient coverage without requiring direct contact. This partial overlap approach ensures complete protection while eliminating the wear and particle generation that would result from friction between contacting surfaces.
Solution Approach 2:
A non-contacting magnetic field or electric field is introduced as an intermediary force to hold the shield members in their protective positions, eliminating the need for mechanical contact between shield components while maintaining stable, effective shielding coverage.
Data Source
AI summary
The present disclosure provides a thin-film-deposition equipment with double-shaft shielding device, which includes a reaction chamber, a carrier and a double-shaft shielding device. The double-shaft shielding device includes a first-connecting arm, a second-connecting arm, a first-shield member, a second-shield member, a first driver and a second driver. The first driver is connected to the first-shield member via the first-connecting arm, and the second driver is connected to the second-shield member via the second-connecting arm, for respectively driving and swinging the two shield members to move in opposite directions via the two connecting arms. Thereby, during a cleaning process of the thin-film-deposition equipment, the two drivers swing the two shield members toward each other into a shielding state for covering the carrier, such that to effectively prevent removed pollutants from polluting the carrier during.