Double-Shell Housing Structure for IP68 Sealing With Less Potting
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Solution Overview
Problem
Conventional housings for electronic devices, particularly electrical ballasts, face challenges in achieving high IP protection classes while minimizing material usage, cost, and weight, and optimizing assembly efficiency, especially in applications like greenhouses where high power consumption and environmental exposure are concerns.
Innovation Solution
A double-shell housing design where a first inner housing part with electronic components is not filled with potting material, and a gap between this part and a second outer housing part is sealed with potting material, achieving IP67 or IP68 protection without filling the interior, resulting in significant material and weight savings and improved assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the interior of the housing is completely filled with potting material to achieve high IP protection classes, then moisture protection is improved, but material usage and weight increase significantly
Solution Approach 1:
The housing interior is divided into two distinct spaces: a first interior space containing the electronic device that remains empty, and a second interior space between the first housing part and second housing part that is filled with potting material. This segmentation allows the potting material to seal the gap and provide IP protection without filling the entire housing interior, reducing material consumption by up to 70%.
Solution Approach 2:
The electronic device is extracted from the potting material filling process. By designing a separate first housing part that encloses the electronic device, the device is removed from the space that would otherwise be filled with potting material. Only the gap space is filled with potting material to provide sealing, while the device housing space remains empty.
2Reliability
If the housing is completely filled with potting material to prevent water ingress, then protection against water jets and submersion is improved, but production cost and transport cost increase
Solution Approach 1:
The housing interior is segmented into a first interior space for the electronic device and a second interior space for potting material filling. This segmentation reduces the volume of potting material required by up to 70%, directly lowering material costs and subsequent production and transport costs while maintaining IP67 or IP68 protection ratings through proper sealing of the gap space.
3Reliability
If the housing is completely filled with potting material to ensure protection against moisture and corrosion, then reliability in outdoor environments is improved, but assembly time and complexity increase
Solution Approach 1:
The housing is segmented into a first housing part containing the electronic device and a second housing part forming the outer shell, with a gap space between them. This segmentation simplifies the assembly process: the electronic device is installed in the first housing part, then the first housing part is positioned within the second housing part, and finally potting material is injected to fill the gap. This structured approach reduces assembly complexity compared to completely filling the housing interior.
4Reliability
If the housing is completely filled with potting material to achieve IP67 or IP68 protection, then moisture protection is improved, but weight of the device increases
Solution Approach 1:
The housing interior is segmented into an empty first interior space for the electronic device and a potting-material-filled second interior space for sealing. This segmentation reduces the volume of potting material required by up to 70%, directly reducing device weight while maintaining IP67 or IP68 protection ratings through effective sealing of the gap space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves substantial material savings of up to 70%, reduces weight, lowers production and transport costs, enhances sustainability by facilitating easier recycling, and improves assembly accuracy and speed, while maintaining high moisture protection and heat dissipation capabilities.
Implementation Method 1
A gap which is formed between the first inner housing part and the second housing part and is sealed by both housing parts and filled with a potting material
Implementation Method 2
This reduces phenomena such as discharges between the live components, absorbs shocks and vibrations and, in particular, prevents the ingress of water, moisture or corrosive agents from outside
Implementation Method 3
maintaining high moisture protection and heat dissipation capabilities
Data Source
AI summary
A housing for an electronic device may include a first housing part for receiving the electronic device and a second housing part for completely receiving the first housing part therein. A gap formed between the two housing parts may be sealed by both housing parts and filled with a potting material, while an interior of the first housing part is not filled with the potting material. The first housing part may be formed separately from the second housing part and spaced from the second housing part by a number of spacers to form the gap. The first housing part, including the spacers, may be dimensioned with respect to the second housing part such that it is insertable into a fixed spatial position within the second housing part in sliding contact between the spacers and the second housing part before the potting material substantially completely surrounds the first housing part.