Double Side Conductive Film Bubble Prevention
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Solution Overview
Problem
The manufacturing of double-side conductive films, such as those used in display devices and touch panels, faces challenges with bubble formation during high-temperature thermal treatment, which degrades the optical properties and peel strength of the film.
Innovation Solution
A method involving the use of an intermediate base layer with pressure-sensitive adhesive composition applied on both sides, ensuring a room temperature peel strength of 1000 gf/inch or more between the conductive base layers and the intermediate base layer, preventing bubble generation and delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If thermal treatment is performed at high temperature to crystallize the conductive layer, then the crystallization of the conductive layer is improved, but bubbles are generated in the conductive film due to low molecular weight components in the plastic film
Solution Approach 1:
A release film is introduced as an intermediary layer between the plastic film and the conductive layer. This release film acts as a mediator that allows bubbles generated during thermal treatment to escape from between the plastic film and conductive layer, preventing bubble entrapment while maintaining the necessary thermal treatment for crystallization.
Solution Approach 2:
The structure is segmented into multiple layers: plastic film, release film, and conductive layer. This segmentation creates a controlled interface where bubbles can be managed and expelled through the release film rather than being trapped in the final conductive film product.
2Adaptability or versatility
If conductive layers are formed on both sides of the plastic film, then the functionality of the film is improved, but it becomes more difficult to remove bubbles generated during thermal treatment
Solution Approach 1:
The release film serves as a mediator that facilitates bubble removal from both sides of the double-side conductive structure. By placing the release film between the plastic film and conductive layers before thermal treatment, bubbles generated during crystallization can escape through the release film interfaces, solving the bubble entrapment problem inherent in double-side configurations.
3Ease of manufacture
If conventional methods are used to attach conductive base layers to the intermediate base layer, then the manufacturing process is simple, but the peel strength is insufficient and bubbles are generated
Solution Approach 1:
The attachment system uses a composite structure consisting of an intermediate base layer with adhesive layers on both sides to which conductive base layers are attached. This composite material approach achieves high peel strength (1000 gf/inch or more) while maintaining manufacturing simplicity, as the adhesive layers are applied in a straightforward manner to the intermediate base layer before attaching the conductive base layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents bubble formation and maintains excellent optical properties and peel strength, even with conductive layers on both sides of the film, enhancing the film's durability and performance.
Implementation Method 1
a layer of a pressure-sensitive adhesive composition is formed on both sides of the intermediate base layer, and crosslinking is induced on the layer of the pressure-sensitive adhesive composition
Implementation Method 2
crosslinking is induced on the layer of the pressure-sensitive adhesive composition through thermal treatment
Implementation Method 3
conductive base layers are attached to both sides of the intermediate base layer by means of a layer of a pressure-sensitive adhesive composition
Data Source
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AI summary
The present application relates to a conductive film, a production method for the same, and a use of the same. The present application is capable of providing, for example, a conductive film without air bubbles, etc. which are generated by heat treatment, etc. during a production process, and inhibit optical physical properties. In particular, the present application can provide a conductive film without generation of air bubbles even in a structure in which the conductive layers exist on both sides of the conductive film.