Double Side Cooling Power Semiconductor Module Design
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Solution Overview
Problem
Existing electric power conversion devices for vehicles face challenges in achieving both low height and miniaturization while maintaining effective cooling performance, as the sealing and mounting structures hinder these goals.
Innovation Solution
A double side cooling power semiconductor module design featuring a case with heat radiation portions, a terminal through hole, and a sealing surface, along with a reference surface that overlaps with the sealing surface, allowing for improved cooling efficiency and compact dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a sealing portion and mounting portion are added to cool the power semiconductor device from both sides, then cooling performance is improved, but device height increases
Solution Approach 1:
The patent merges the sealing function and mounting function into a single integrated structure. The sealing plate serves both as a sealing portion for the cooling chamber and as a mounting portion for fixing the power semiconductor device, eliminating the need for separate sealing and mounting components that would increase height
Solution Approach 2:
The sealing plate is designed with multi-functionality: it seals the cooling chamber, provides mounting surfaces for the power semiconductor device, and facilitates thermal conduction. This universal component replaces what would traditionally require multiple separate parts, thereby reducing overall device height while maintaining effective cooling
2Temperature
If a sealing portion and mounting portion are added to cool the power semiconductor device from both sides, then cooling performance is improved, but device size increases
Solution Approach 1:
The sealing plate integrates multiple functions (sealing, mounting, thermal conduction) into a single component, reducing the number of parts and overall device volume while maintaining effective cooling from both sides
Solution Approach 2:
The power semiconductor device is nested within the cooling chamber formed by the case and sealing plate, with the sealing plate acting as both the chamber closure and mounting surface. This nested arrangement optimizes space utilization and minimizes device footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables both low height and miniaturization of the electric power conversion device while maintaining effective cooling performance, suitable for vehicle applications and other motor control systems.
Implementation Method 1
a first heat radiation portion (305a) disposed to face the accommodation space (306); a second heat radiation portion (305b) disposed to face the first heat radiation portion (305a) sandwiching the accommodation space (306)
Data Source
AI summary
An object of the present invention is to achieve both low height and miniaturization of a double side cooling type electric power conversion device. A power semiconductor module according to the present invention includes: a circuit body including a power semiconductor device and a terminal; and a case forming an accommodation space for accommodating the circuit body, wherein the case includes: a first heat radiation portion and a second heat radiation portion disposed to face each other sandwiching the accommodation space; a first opening that is disposed at a side portion to the first heat radiation portion and through which the terminal passes; a sealing surface formed to surround the first opening; and a reference surface disposed at a side portion to the second heat radiation portion, and the reference surface is formed on a surface opposite to a surface on which the sealing surface of the case is disposed such that, when projection is performed from a vertical direction of the reference surface, a projection of the reference surface and a projection of the sealing surface overlap each other.