Double-Side Cooling Power Module Package Assembly
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Solution Overview
Problem
Conventional power module package structures employ a single side cooling mechanism, which limits heat dissipation efficiency due to the thermal resistance of the covering member and does not provide an effective thermal conduction path, leading to unsatisfactory heat dissipation and reduced operational performance and lifespan.
Innovation Solution
A package assembly utilizing a double side cooling mechanism, where a first heat dissipating module is attached to one surface of the power module and a second heat dissipating module is integrated within a housing frame on the opposite surface, enhancing heat dissipation through both passive and active means, such as cold plates and water-cooled heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single side cooling mechanism is used with a covering member, then the power module can be packaged and protected, but the heat dissipation efficiency is limited due to thermal resistance of the covering member
Solution Approach 1:
The cooling mechanism is segmented into two independent heat dissipating modules positioned on opposite sides of the power module. Each module independently dissipates heat from one surface, eliminating the thermal resistance bottleneck of a single covering member and enabling parallel heat dissipation pathways.
Solution Approach 2:
The cooling approach transitions from single-sided (one-dimensional heat dissipation path) to double-sided cooling (two-dimensional heat dissipation paths). By utilizing both surfaces of the power module for heat dissipation, the thermal management system effectively doubles the heat dissipation capacity.
2Object-affected harmful factors
If a covering member with high thermal resistance is used to protect the power module, then the power module is well protected, but the thermal conduction path is poor and heat dissipation is insufficient
Solution Approach 1:
Instead of having the covering member directly contact the heat sink (conventional approach), the invention inverts the thermal path by placing heat dissipating modules on both sides of the power module. This allows heat to be conducted directly from the power module surfaces to the cooling modules without passing through the thermal resistance of the covering member.
Solution Approach 2:
The power module itself serves as an intermediary thermal conduction path. By attaching heat dissipating modules to both surfaces of the power module, the power module's own structure becomes the primary thermal conduction medium, bypassing the need for heat to traverse the covering member.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The double side cooling mechanism significantly improves heat dissipation efficiency and operational performance, extending the lifespan of the power module by effectively dissipating heat from both surfaces, and allows for flexible selection of active or passive heat dissipating modules based on requirements.
Implementation Method 1
The second surface of the power module is attached on the first heat dissipating module
Implementation Method 2
dissipating the heat of the power module to the surroundings by a double side cooling mechanism
Implementation Method 3
The second heat dissipating module is disposed within the hollow part of the housing frame and attached on the middle region of the first surface of the power module
Implementation Method 4
dissipating the heat of the power module to the surroundings by a double side cooling mechanism
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A package assembly (1, 1a, 1b) includes a housing frame (2, 2a), a power module (3), a first heat dissipating module (4) and a second heat dissipating module (5. 5a). The housing frame (2, 2a) is fixed on the first heat dissipating module (4). The power module (3) is disposed within a hollow part (22) of the housing frame (2, 2a), and covers a first open end (23) of the hollow part (22). The power module (3) includes a first surface (31), a second surface (32) and at least one pin (33). The first surface (31) has a periphery region (31a) and a middle region (31b). The second surface (32) is attached on the first heat dissipating module (4). The at least one pin (33) is disposed on the periphery region (31a). The at least one pin (33) is penetrated through the corresponding opening (25) and partially exposed outside the housing frame (2, 2a). The second heat dissipating module (5, 5a) is disposed within the hollow part (22) and attached on the middle region (31b) of the first surface (31) of the power module (3).