Double-Side Cooling Semiconductor Module in Power Conversion Apparatus
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Solution Overview
Problem
Existing electric power conversion apparatuses for vehicles face challenges in miniaturization, reliability, and cooling efficiency, particularly due to increased heat generation during power conversion, leading to size and complexity issues, and insufficient cooling solutions for both semiconductor modules and capacitor modules.
Innovation Solution
The apparatus incorporates a double-side cooling semiconductor module with heat dissipation metals, a channel case with a cooling water channel, and a capacitor module, where the semiconductor module is inserted into the channel case for efficient cooling, and the capacitor module is thermally bonded with the channel case for direct cooling, reducing size and complexity while enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling structures are used for semiconductor modules, then heat dissipation is achieved, but the apparatus size increases and assembly complexity increases
Solution Approach 1:
The patent combines the cooling structure with the semiconductor module housing into an integrated unit. The housing serves dual functions as both structural enclosure and heat dissipation component, eliminating the need for separate cooling apparatus and reducing overall size
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: mechanical protection of semiconductor components, structural support, and active heat dissipation through integrated coolant flow paths. This multi-functionality reduces the number of separate components needed
2Temperature
If conventional cooling structures are used for semiconductor modules, then heat dissipation is achieved, but device complexity increases
Solution Approach 1:
By merging the cooling channels directly into the housing structure, the patent eliminates multiple separate cooling components and their associated assembly steps. The integrated design reduces assembly complexity while maintaining effective heat dissipation
3Ease of manufacture
If semiconductor modules are cooled from one side only, then assembly is simplified, but cooling efficiency is insufficient
Solution Approach 1:
The patent transitions from single-side cooling to dual-side cooling by extending coolant flow paths to contact semiconductor modules from both opposite sides. This dimensional expansion of the cooling approach significantly improves heat dissipation efficiency
4Device complexity
If capacitor modules are not directly cooled, then structure is simplified, but heat management is insufficient
Solution Approach 1:
The patent integrates capacitor module cooling into the housing structure by incorporating coolant flow paths that directly contact the capacitor modules. This merging of cooling functionality into the existing housing maintains structural simplicity while improving heat management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves significant miniaturization, improved cooling efficiency, and increased reliability by effectively managing heat dissipation, reducing voltage spikes, and simplifying electrical connections, thereby enhancing the overall performance and productivity of the electric power conversion apparatus.
Implementation Method 1
the semiconductor module is inserted into the channel case for efficient cooling, and the capacitor module is thermally bonded with the channel case for direct cooling
Implementation Method 2
a channel case with a cooling water channel, where the semiconductor module is inserted into the channel case for efficient cooling
Data Source
AI summary
An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.