Double-Side Cooling Package With Extensible Connectors for Thermal Stress
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Solution Overview
Problem
Conventional power semiconductor packages face issues with heat dissipation, thermal expansion, and temperature deviations due to direct contact with cooling channels, leading to potential damage and inefficient cooling.
Innovation Solution
A double-side cooling power semiconductor package with extensible connecting members on both sides of the package, allowing for thermal deformation absorption and increased heat exchange area, using corrugated pipes and coolers with inner and outer plates to manage thermal stress and enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling channel is disposed to have a long length to sequentially pass through upper and lower surfaces of the power semiconductor package, then the cooling coverage is improved, but the flow resistance of the cooling fluid increases
Solution Approach 1:
The cooling channel is divided into multiple separate channels (first cooling channel and second cooling channel) that are disposed in parallel on different surfaces of the power semiconductor package. This segmentation allows the cooling fluid to flow through shorter paths simultaneously rather than sequentially, reducing flow resistance while maintaining comprehensive cooling coverage.
2Device complexity
If a cooling channel is disposed to sequentially pass through upper and lower surfaces, then the cooling structure is simplified, but temperature deviation between cooling fluid in different regions increases
Solution Approach 1:
The cooling system is segmented into multiple independent cooling channels that operate in parallel. The first cooling channel is disposed on the upper surface and the second cooling channel is disposed on the lower surface, allowing simultaneous cooling of different regions with cooling fluid at relatively uniform temperatures, thereby reducing temperature deviation.
3Area of stationary object
If the cooling channel surface is structured to be in direct contact with the power semiconductor package surface, then the cooling contact area is maximized, but heat exchange efficiency is insufficient
Solution Approach 1:
The cooling channel structure transitions from a two-dimensional surface contact to a three-dimensional configuration by forming recesses in the cooling channel surface that penetrate into the power semiconductor package. This dimensional change increases the heat exchange surface area and improves thermal contact between the cooling channel and the package, thereby enhancing heat exchange efficiency.
4Area of stationary object
If coolers are disposed on both sides of the power semiconductor package, then the heat dissipation area is increased, but thermal expansion stress concentrates in joint regions
Solution Approach 1:
The connecting members that join the coolers to the power semiconductor package are designed with flexible characteristics, allowing them to accommodate thermal expansion and contraction of the package. This flexibility prevents stress concentration in the joint regions while maintaining the increased heat dissipation area provided by the dual-side cooler configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses thermal deformation and temperature deviations, enhances heat dissipation, and prevents damage to the package and coolers by absorbing thermal expansion, ensuring uniform cooling and improved heat exchange.
Implementation Method 1
when the power semiconductor package is thermally deformed (contracted and expanded), the connecting members may respectively absorb the deformation by being contracted and extended, thereby suppressing damage to the power semiconductor package and the coolers from occurring
Implementation Method 2
the connecting member is configured to be extensible
Implementation Method 3
a plurality of coolers provided with passages of cooling fluid thereinside, respectively, and disposed on both plate surfaces of the power semiconductor package, respectively, so as to allow heat exchange
Implementation Method 4
the cooling fluid, whose temperature has increased by absorbing heat energy generated from the power semiconductor package, moves to the outlet portion (22022) by way of the outlet-side vertical connecting member (300b)
Implementation Method 5
the cooling fluid, whose temperature has increased by absorbing heat energy generated from the power semiconductor package
Data Source
AI summary
The present invention relates to a double-side-cooling power semiconductor package and comprises: a planar power semiconductor package; a plurality of coolers which have therein a flow path for a cooling fluid, and are respectively disposed on both planar sides of the power semiconductor package so as to allow heat exchange; and a connecting member which has therein the flow path for the cooling fluid, and is connected to the plurality of coolers so as to be in communication therewith, wherein the connecting member is configured to be extensible. Accordingly, the occurrence of deformation and damage in the event of thermal expansion of the power semiconductor package can be inhibited.