Double Side Electrode Semiconductor Package via Die-Molded Through Holes

The patent applies preliminary action by pre-forming conductive patterns on the package substrate before mounting the semiconductor chip. The front surface electrode pattern and back surface electrode pattern are created in advance, eliminating the need for complex post-chip-processing steps like laser drilling or recess formation. This preliminary preparation of conductive paths resolves the technical contradiction by establishing reliable electrical connections through a simplified, less complex manufacturing process.

The patent inverts the conventional approach by instead of creating recess portions in the substrate to reduce thickness, it forms protruding conductive patterns that extend toward the chip. The front surface electrode pattern and back surface electrode pattern are formed as raised structures that make direct contact with chip electrodes, thereby eliminating the need for substrate recesses while maintaining thin package profile. This inversion of the structural approach resolves the contradiction between thickness reduction and manufacturing complexity.

The patent merges multiple electrical connection functions into a single integrated structure. Instead of forming numerous separate through holes via laser radiation, it creates continuous conductive patterns that extend from the front surface through the substrate to the back surface. The front surface electrode pattern and back surface electrode pattern are connected through conductive traces formed in the substrate, combining multiple connection paths into a unified conductive network. This merging approach maintains excellent electrical connectivity while dramatically improving productivity by eliminating time-consuming laser drilling operations.