Double Side Mounted MCM Package for Memory Channel Length Reduction
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Solution Overview
Problem
Current multi-chip module packaging faces challenges in reducing overall package size and memory channel length due to increasing memory requirements, leading to performance degradation and substrate yield and cycle time issues in large flip chip ball grid array packages.
Innovation Solution
The implementation of a double side mounted package structure with memory packages mounted on both sides of a module substrate, utilizing a coreless or thin core substrate to segregate signal routing and reduce package height, and a laminate routing substrate for general purpose routing, thereby reducing memory channel length and package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory packages are mounted around a logic die in a conventional single-side arrangement, then memory capacity requirements can be met, but the overall package size increases and memory channel length increases leading to performance degradation
Solution Approach 1:
The patent transitions from a conventional single-side mounting arrangement to a double-side mounting arrangement, utilizing the third dimension (z-axis) by mounting memory packages on both the top and bottom sides of the module substrate. This dimensional change allows memory packages to be positioned closer to the logic die, reducing memory channel length while accommodating increased memory capacity requirements
2Quantity of substance
If a large flip chip ball grid array package is used to meet memory requirements, then memory capacity is sufficient, but substrate yield decreases and cycle time increases
Solution Approach 1:
By utilizing double-side mounting, the patent reduces the lateral footprint and memory channel length, enabling the use of smaller, more manufacturable substrates. This improves substrate yield and reduces cycle time while still meeting memory capacity requirements through efficient use of both sides of the substrate
3Length of stationary object
If signal routing is provided within the module substrate for double side mounted packages, then memory channel length is reduced, but substrate complexity increases
Solution Approach 1:
The patent introduces a routing substrate as a separate component that handles general purpose routing and power routing, while the module substrate focuses on signal routing. This segmentation of routing functions reduces the complexity of the module substrate while achieving the goal of reduced memory channel length through direct signal paths
Data Source
AI summary
Double side mounted package structures and memory modules incorporating such double side mounted package structures are described in which memory packages are mounted on both sides of a module substrate. A routing substrate is mounted to a bottom side of the module substrate to provide general purpose in/out routing and power routing, while signal routing from the logic die to double side mounted memory packages is provided in the module routing. In an embodiment, module substrate is a coreless module substrate and may be thinner than the routing substrate.