Double Side Probe System With Support Device
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Solution Overview
Problem
Conventional probe systems for double side probing cause substrate deformation when contacting the DUT, leading to inaccurate alignment between the optical probe device and the DUT, resulting in low test accuracy.
Innovation Solution
A probe system configuration that includes a chuck with a through hole to support the substrate's edge, an upper and lower probe device, and a support device with a movable supporter to resist the force applied by the electrical probe, ensuring the substrate remains undformed during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the chuck only supports the edge of the wafer to enable top side and bottom side probing, then the probing accessibility is improved, but the wafer deforms when contacted by the electrical probe device causing misalignment
Solution Approach 1:
A support device is introduced as an intermediary element between the chuck and the wafer. This support device includes a support table that can be positioned adjacent to the electrical probe device to provide additional support to the wafer during probing operations, preventing deformation while maintaining accessibility
Solution Approach 2:
The support device is designed to be movable relative to the chuck, allowing dynamic adjustment of the support position. This enables the support table to be positioned at different locations depending on the specific probing requirements, optimizing both accessibility and alignment accuracy for different test scenarios
2Adaptability or versatility
If the wafer is supported only at the edge for double side probing, then the probing flexibility is improved, but the wafer stability deteriorates under probe contact force
Solution Approach 1:
The support device acts as a mediator that provides additional stability to the wafer without restricting the probing flexibility. The support table can be positioned to provide stable support while allowing the electrical and optical probe devices to access both sides of the wafer freely
Solution Approach 2:
The support device serves multiple functions: it provides mechanical support to prevent wafer deformation, maintains wafer stability during probing, and allows dynamic repositioning to accommodate different probing configurations. This multi-functional design maintains both flexibility and stability
Data Source
AI summary
A probe system for double side probing includes a chuck having a through hole for a substrate including a DUT to be disposed on the chuck and defined with an edge part supported by the chuck and a central part located correspondingly to the through hole, upper and lower probe devices, including electrical and optical probe devices, disposed above and below the through hole respectively for testing the DUT on top and bottom sides of the substrate, and a support device disposed on the side of the chuck opposite to the electrical probe device. When an electrical probe of the electrical probe device contacts the top or bottom side of the substrate, a supporter of the support device contacts the other side and is located adjacent to the electrical probe with the substrate located therebetween to resist the force from the electrical probe to avoid substrate deformation.