Double-Sided Bonding Region for High-Density Display Panel Pins
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Solution Overview
Problem
High-resolution display screens face challenges in increasing bonding precision and reducing bonding difficulty due to the need for more pins, which complicates the electrical connection between the display panel and the flexible circuit board.
Innovation Solution
The display panel design includes a bonding region with first and second pins disposed on opposite surfaces, allowing for increased pin density while maintaining bonding accuracy and reducing complexity by using transmission lines on different film layers, thereby enhancing the electrical connection and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the bonding width of the flexible circuit board is increased to increase the number of golden fingers, then the number of pins can be increased to support higher resolution, but the bonding precision is reduced and bonding difficulty is increased
Solution Approach 1:
The patent transitions from a single-sided pin arrangement to a double-sided pin arrangement, utilizing both the front surface and back surface of the bonding region. This dimensional change allows pins to be distributed across two surfaces, effectively doubling the pin capacity without increasing the bonding width, thereby maintaining bonding precision while supporting higher resolution displays
Solution Approach 2:
The bonding region is segmented into two distinct surfaces (front and back), each carrying its own set of pins. This segmentation allows the pins to be divided into two groups, with each group independently bonded to corresponding golden fingers on the flexible circuit board, reducing the density requirement on each individual bonding surface and maintaining bonding precision
2Quantity of substance
If the bonding width of the flexible circuit board is increased to increase the number of golden fingers, then the number of pins can be increased to support higher resolution, but the bonding difficulty is increased
Solution Approach 1:
By utilizing the back surface of the bonding region in addition to the front surface, the patent creates two independent bonding interfaces. This allows the bonding process to be divided into two separate, manageable operations rather than one complex high-density bonding operation, thereby reducing overall bonding difficulty while accommodating more pins
Solution Approach 2:
The bonding process is segmented into two independent bonding operations: one for the front surface pins and one for the back surface pins. Each bonding operation involves a smaller number of pins with lower density requirements, making each individual bonding process easier to execute with standard equipment and procedures
Data Source
AI summary
A display panel and a display apparatus are provided. A display panel includes a display region and a bonding region bonding a flexible circuit board with the display panel. The bonding region comprises a first surface located at a displaying side of the display panel and an opposing second surface, and includes a plurality of first pins and a plurality of second pins. The plurality of first pins are disposed at the first surface of the bonding region, and the plurality of second pins are disposed at the second surface of the bonding region. The display panel also includes a plurality of first transmission lines and a plurality of second transmission lines. A first transmission line is connected to a first pin, a second transmission line is connected to a second pin, and the second transmission line and the second pin are disposed at different film layers.