Double-Sided Semiconductor Cooler Assembly for Compact Chip Interconnection
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Solution Overview
Problem
There is a challenge in miniaturizing semiconductor devices while ensuring easy and efficient electrical connections between semiconductor chips mounted on both the top and bottom plates of a cooler, as existing methods face limitations in reducing the mounting area effectively.
Innovation Solution
A semiconductor device design that includes a first and second semiconductor unit with respective substrates and wiring boards, a cooling unit with opposite cooling surfaces, and an output terminal connected to both wiring boards, allowing for easy electrical connection and miniaturization by sandwiching the cooling unit between the semiconductor units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If semiconductor chips are mounted on both top and bottom plates of a cooler to reduce mounting area, then device miniaturization is achieved, but electrical connection complexity increases
Solution Approach 1:
The patent transitions from planar mounting on a single plate to three-dimensional mounting on both top and bottom plates of the cooler. This vertical stacking approach reduces the horizontal mounting area while the cooler body itself serves as the interconnection structure, eliminating the need for complex external wiring between separate modules.
Solution Approach 2:
The patent combines multiple functions into the cooler structure: it serves as both the thermal management component and the electrical interconnection substrate. The cooler body integrates cooling channels, mounting surfaces, and electrical connection paths, thereby simplifying the overall system architecture while achieving miniaturization.
2Area of stationary object
If substrates are mounted on both top and bottom plates, then mounting area is reduced, but ease of electrical connection deteriorates
Solution Approach 1:
The cooler structure is designed to perform multiple functions simultaneously: thermal conduction, mechanical support, and electrical connection. The body of the cooler acts as a universal interconnection medium that provides both cooling and electrical pathways between the upper and lower substrates, making the system easier to assemble and connect.
Solution Approach 2:
The cooler body serves as an intermediary structure that mediates between the upper and lower substrates. It provides built-in electrical connection interfaces and mounting surfaces, eliminating the need for separate connection mechanisms and simplifying the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables miniaturization of semiconductor devices while simplifying electrical connections, improving handling and thermal management by utilizing a cooling unit with opposite cooling surfaces and output terminals connected to both wiring boards.
Implementation Method 1
a cooler with a top plate on which the substrate is mounted
Data Source
AI summary
A semiconductor device includes a first semiconductor unit that includes a first substrate including a first wiring board to which a first semiconductor chip is bonded, a second semiconductor unit that includes a second substrate including a second wiring board to which a second semiconductor chip is bonded, a cooling unit including a first cooling surface and a second cooling surface that are opposite to each other and respectively have the first semiconductor unit facing the first substrate thereon and the second semiconductor unit facing the second substrate thereon, and an output terminal provided at a first side of the cooling unit and being connected to both the first wiring board and the second wiring board.