Double-Sided Cooler for Integrated Thermal Management

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Solution Overview

Problem

Next-generation wide band-gap power switches, such as those using Silicon Carbide (SiC) or Gallium Nitride (GaN), generate more heat due to higher operating frequencies, requiring effective thermal management to prevent damage and efficiency loss, while existing heat sinking solutions add complexity and cost with separate components.

Innovation Solution

An integrated thermal management assembly with a double-sided cooler positioned between the driver board and power board, featuring coolant channels and fluid conduits to dissipate heat efficiently, eliminating the need for separate cooling apparatuses by integrating heat management directly within the power electronic device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If separate heat sinking devices are used for power electronic devices, then heat dissipation is achieved, but device complexity and cost increase

Engineering Contradiction:

Improveheat dissipationVSAvoidcomponent integration

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the heat dissipation function with the structural support function by integrating the heat sink directly into the housing of the power electronic device. The housing serves dual purposes: providing mechanical support and acting as a heat dissipation structure, thereby eliminating the need for separate heat sinking components and reducing overall device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing structure is designed to perform multiple functions simultaneously: it provides mechanical support, electrical insulation, and heat dissipation. This multi-functional design allows a single component to replace what would traditionally require multiple separate components, including the heat sink, thereby reducing complexity and cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If higher frequency operation is used in wide band-gap switches, then power conversion performance improves, but heat generation increases

Engineering Contradiction:

Improveswitching frequencyVSAvoidheat generation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent converts the harmful effect of increased heat generation into a beneficial design opportunity by incorporating the heat dissipation function directly into the housing structure. The housing is designed with thermal pathways and heat dissipation features that actively utilize the heat generated by high-frequency switching, transforming the problem of heat management into an integrated design solution that supports higher frequency operation.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Temperature

If multiple separate components are used for thermal management, then heat dissipation effectiveness is maintained, but packaging efficiency decreases

Engineering Contradiction:

Improvethermal managementVSAvoidpackaging efficiency

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent merges the thermal management function with the structural housing, eliminating the need for separate heat sinking components. This integration reduces the overall volume required for packaging while maintaining effective heat dissipation, as the housing itself serves as the heat dissipation structure rather than requiring additional space for separate thermal management components.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces size, weight, and maintenance costs, enhances reliability and durability, and allows for higher frequency operation of power switches by efficiently managing heat, thereby improving performance and packaging efficiency.

Implementation Method 1

a first coolant channel in between the first surface and the second surface. The thermal management assembly includes a coolant that flows within the first coolant channel and that is configured to dissipate heat projected through the double-sided cooler

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a coolant that flows within the first coolant channel and that is configured to dissipate heat projected through the double-sided cooler

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10149413B1Integrated thermal management assembly for gate drivers and power components

Publication Date: 2018.12.04 TOYOTA JIDOSHA KK

AI summary

An integrated thermal management assembly, device or system for a power conversion device having a driver board and a power board. The integrated thermal management assembly includes a double-sided cooler. The double-sided cooler has a first layer that includes a first surface that is positioned below an inner surface of the power board. The double-sided cooler has a second surface positioned above an inner surface of the driver board. The double-sided cooler includes a first coolant channel in between the first surface and the second surface. The thermal integrated assembly includes a coolant that flows within the first coolant channel and that is configured to dissipate heat projected through the double-sided cooler.