Double-Sided Heat Dissipation Assembly for Dense Computing Boards
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Solution Overview
Problem
High-density and high-power computing devices generate excessive heat due to chip integration, leading to poor heat dissipation efficiency and potential damage from uneven pressure distribution with monolithic heat sinks.
Innovation Solution
A computing apparatus with a circuit board featuring a first heat dissipation assembly on one surface and separate second heat dissipation assemblies for each computing unit on the opposite surface, utilizing a metal plating layer for secure attachment and airflow channels for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a monolithic heat sink is installed on the whole circuit board, then heat dissipation coverage is improved, but contact uniformity and chip safety deteriorate due to machining tolerance and height difference
Solution Approach 1:
The patent divides the monolithic heat sink into multiple independent heat dissipation assemblies, each corresponding to a specific computing unit. This segmentation allows each assembly to independently contact its target chip, eliminating the contact uniformity issues caused by machining tolerances and height differences while maintaining comprehensive heat dissipation coverage across the circuit board.
2Device complexity
If a monolithic heat sink is used, then overall heat dissipation structure is simplified, but heat dissipation efficiency deteriorates due to poor contact and excessive grease thickness
Solution Approach 1:
By segmenting the heat dissipation system into multiple independent assemblies, each assembly achieves optimal contact with its corresponding computing unit. This eliminates excessive heat conduction grease thickness and poor contact issues, significantly improving heat dissipation efficiency despite the increased number of components.
3Reliability
If separate heat dissipation assemblies are used for each computing unit, then heat dissipation efficiency and contact uniformity are improved, but device complexity increases
Solution Approach 1:
The patent implements segmentation by creating multiple independent heat dissipation assemblies, each tailored to a specific computing unit. This approach prioritizes heat dissipation effectiveness and contact uniformity, accepting increased device complexity as a necessary trade-off for reliable operation of high-density computing devices.
Solution Approach 2:
Each heat dissipation assembly is locally optimized for its specific computing unit, with dimensions and mounting characteristics matched to the local thermal and mechanical requirements. This local quality approach ensures optimal heat dissipation performance at each location, justifying the increased overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency through double-sided cooling, ensuring full contact and attachment of computing units without risk of damage from excessive pressure, while maintaining effective temperature uniformity.
Implementation Method 1
a heat conduction material is filled between the first heat dissipation assembly and the second surface
Implementation Method 2
a gas flows through the plurality of second heat dissipation assemblies by the airflow channel
Implementation Method 3
arranged in parallel on the second heat dissipation assembly
Data Source
AI summary
The present application discloses a computing apparatus and a heat dissipation apparatus, where the computing apparatus includes: a circuit board, a first surface of which is provided with at least one computing unit; a first heat dissipation assembly, arranged on a second surface of the circuit board, the second surface being opposite to the first surface; and at least one second heat dissipation assembly, correspondingly arranged on a package of the at least one computing unit, respectively. Through the present application, a heat dissipation efficiency of the computing apparatus can be improved.