Double-Sided Liquid Cooling for Semiconductor Power Modules
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Solution Overview
Problem
Conventional semiconductor power modules face limitations in heat dissipation, primarily due to thermal paths being comparably long and inefficient, which restricts their current capability and increases the number of modules required in applications, especially in high-voltage scenarios.
Innovation Solution
A semiconductor power device with a double-sided liquid cooling system, featuring upper and lower flow sections with distinct flow directions, allowing coolant to flow through both sections to provide effective heat dissipation from both the top and bottom sides of the power module, reducing thermal resistance and enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional single-sided cooling is used, then the structure is simple, but the heat dissipation efficiency is insufficient leading to long thermal paths
Solution Approach 1:
The cooling system is segmented into two independent flow sections: an upper flow section with inlet 12 and outlet 13, and a lower flow section with inlet 22 and outlet 23. Each section has its own coolant flow path (upper flow path 15 and lower flow path 25 respectively), allowing separate cooling of different regions of the power module 3 to reduce thermal paths and improve heat dissipation efficiency
Solution Approach 2:
The cooling system transitions from single-sided to double-sided cooling by adding the upper flow section above the power module 3 and the lower flow section below it. This three-dimensional arrangement with coolant flowing in opposite directions (effective upper flow direction 11 and effective lower flow direction 21) creates multiple thermal dissipation pathways, significantly reducing thermal resistance
2Productivity
If the number of power modules is increased to achieve required current capability, then the current capability is sufficient, but the cost and system complexity increase
Solution Approach 1:
The invention changes the thermal management parameters by implementing double-sided liquid cooling with optimized flow paths and opposite flow directions. This improves the heat dissipation capacity of each individual power module 3, allowing fewer modules to achieve the same total current capability, thereby reducing system complexity and cost
3Temperature
If coolant flow paths are optimized for single-sided cooling, then the cooling system is simple, but temperature homogeneity across chips is poor
Solution Approach 1:
The cooling system divides the thermal management into segmented flow paths: upper flow path 15 for cooling the upper surface of power module 3, and lower flow path 25 for cooling the lower surface. This segmentation allows independent optimization of each cooling zone, improving temperature homogeneity across all chips by addressing thermal hotspots from multiple directions
Solution Approach 2:
The invention inverts the conventional single-direction cooling approach by implementing counter-flow cooling where the effective upper flow direction 11 and effective lower flow direction 21 are opposite to each other. This counter-flow configuration optimizes heat extraction efficiency and promotes more uniform temperature distribution across the power module 3
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation, allowing for a higher current capability at a given maximum chip temperature, reducing the number of power modules needed and lowering costs, while ensuring more homogeneous chip temperatures across multiple modules, thereby increasing reliability and reducing temperature differences.
Implementation Method 1
The semiconductor power device is configured such that during operation a coolant flows through the upper and the lower flow section providing a double-sided liquid cooling of the power module
Implementation Method 2
a coolant flows through the upper and the lower flow section providing a double-sided liquid cooling of the power module
Data Source
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AI summary
A effective lower flow direction comprises power module (3) and a housing (2) that is arranged on an upper surface (9) of the power module (3) defining an upper flow section (10) for liquid cooling of the power module (3) in between. The upper flow section (10) comprises an inlet (12), an outlet (13) and a given upper flow path (15) in between defining an effective upper flow direction (11). Further, a cooling unit (5) is arranged on the lower surface (9) of the power module (3) defining a lower flow section (20) for liquid cooling of the power module (3) in between. The lower flow section (20) comprises an inlet (22), an outlet (23) and a given lower flow path (25) in between defining an effective lower flow direction (21), such that during operation a coolant flows through the upper and the lower flow section (10, 20) providing a double-sided liquid cooling of the power module (3). The effective upper flow direction (11) is different from the effective lower flow direction (21), and the inlet (12) of the upper flow section (10) and the outlet (23) of the lower flow section (20) are fluidically connected with each other.