Double-Sided Cooling Module Solder Structure With Support Wire
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Solution Overview
Problem
Conventional methods for controlling the height of double-sided cooling power modules in EV vehicles fail to secure a consistent solder compensation layer, leading to inadequate cooling performance due to uneven contact and solder flow issues during the soldering process.
Innovation Solution
A soldering structure featuring a wire with a convex portion is used to support the soldering target portion, ensuring a consistent distance between the spacer and the metal layer, which allows for proper height adjustment and uniform contact between substrates, thereby maintaining the desired height of the power module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a large amount of solder is provided upon soldering to increase the height of the power module, then the height of the power module is increased, but the solder spreads around horizontally and cannot secure the necessary height of the solder compensation layer
Solution Approach 1:
A support wire is introduced as an intermediary element between the solder compensation layer and the substrate. The wire provides mechanical support to prevent solder from spreading horizontally while allowing the solder to maintain vertical height, thus resolving the contradiction between increasing height and maintaining precision
Solution Approach 2:
The support wire is positioned in advance before soldering occurs. This preliminary placement of the wire creates a physical barrier that prevents solder from spreading horizontally during the soldering process, ensuring that the solder compensation layer maintains its intended height and shape
2Ease of manufacture
If multiple soldering processes are applied to manufacture each part through primary and secondary soldering, then the power module can be manufactured, but it becomes impossible to manufacture the power module to a desired height in the subsequent secondary soldering process
Solution Approach 1:
The support wire serves as a mediator that enables precise height control during the secondary soldering process. By providing a physical reference and support structure, the wire allows the secondary soldering to achieve the desired height without the solder spreading, thus maintaining both manufacturability and height control
3Length of stationary object
If the solder compensation layer is manufactured at a predetermined height or higher, then height adjustment is possible, but the solder flows out horizontally due to the load of parts to be soldered upon the primary soldering process
Solution Approach 1:
The support wire acts as a mediator that stabilizes the solder compensation layer by providing mechanical support. This prevents the solder from flowing horizontally under load while maintaining the predetermined height, thus resolving the contradiction between height and stability
Solution Approach 2:
The support wire is placed in advance before the soldering process to prevent solder from spreading horizontally. This preliminary action ensures that even when a large amount of solder is applied at predetermined height, the solder will not flow out due to part load during primary soldering
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution secures a sufficient height margin for the solder compensation layer, ensuring uniform manufacturing of the power module height and improved cooling performance by maintaining consistent contact between the power module and cooling channels.
Implementation Method 1
a bonding target portion; a metal layer including a bonding surface having a bonding region in which the bonding target portion is bonded by solder
Data Source
AI summary
In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.