Double-Sided Electrode Package With Post-Like Terminals
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Solution Overview
Problem
Conventional package on package (POP) structures face challenges such as limited mounting height, reliability degradation due to warpage, insufficient moisture resistance, and inability to accommodate multi-pin semiconductor chip configurations, primarily due to their structural limitations.
Innovation Solution
A double-sided electrode package with post-like surface side terminals and a manufacturing method that involves forming electrode pads, external connecting pads, and a sealing resin layer to enhance connection reliability and moisture resistance, allowing for arbitrary wiring layouts and cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If packages are stacked on each other in conventional POP structure, then packaging density is improved, but mounting height increases and reliability degrades due to warpage
Solution Approach 1:
The invention divides the package structure into a substrate package and a module package, with the module package further segmented into a semiconductor device and a resin seal. This segmentation allows each component to be optimized independently, reducing warpage effects while maintaining high packaging density through the stacked configuration.
Solution Approach 2:
The invention introduces a resin seal as an intermediary component between the semiconductor device and the substrate package. This resin seal acts as a buffer that absorbs warpage stresses, thereby maintaining connection reliability while enabling the stacked package structure to achieve high packaging density.
2Quantity of substance
If packages are stacked on each other in conventional POP structure, then packaging density is improved, but moisture-resistant reliability is degraded due to insufficient sealing
Solution Approach 1:
The resin seal serves as a protective intermediary that provides superior moisture barrier properties compared to conventional sealing methods. It completely encapsulates the semiconductor device, creating a hermetic seal that prevents moisture ingress while maintaining the compact stacked structure.
Solution Approach 2:
The invention uses a composite structure combining the resin seal material with the substrate and semiconductor device. The resin seal material is specifically selected for its moisture barrier properties, creating a composite package structure that achieves both high packaging density and excellent moisture resistance.
3Adaptability or versatility
If solder ball diameter is reduced to accommodate multi-pin configuration, then pin count increases, but manufacturing precision and connection reliability are degraded
Solution Approach 1:
The invention transitions from using solder balls (spherical, limited surface area) to using a resin seal with integrated contact surfaces (planar, expandable area). This dimensional change allows for larger contact surfaces that can accommodate multiple pins without reducing the effective contact area, thereby maintaining manufacturing precision while enabling multi-pin configurations.
4Device complexity
If conventional POP structure is used, then packaging is simplified, but device complexity increases due to structural limitations
Solution Approach 1:
The invention segments the package into modular components (substrate package, module package, resin seal) that can be independently designed and optimized. This segmentation allows for flexible wiring layouts within each module while maintaining overall structural simplicity, enabling adaptation to different pin configurations without complicating the entire package structure.
Data Source
AI summary
The present invention provides a double-sided electrode package of a structure excellent in the reliability of connection and moisture resistance to another package, which is capable of being manufactured simply and at low cost. The present invention also provides a double-sided electrode package of a structure capable of forming inner wirings (electrode pads) in arbitrary layouts according to the number of pins of a semiconductor chip and the size thereof, which package is capable of being manufactured simply and at low cost. A copper foil is attached onto a core material formed with electrode pads, wirings, through electrodes, lands and a solder resist. The copper foil is wet-etched in several stages to form surface side terminals which stand on the wirings approximately vertically and each of which includes a plurality of protrusions (convex portions continuous in the circumferential direction) formed at their side faces over the full circumference along the circumferential direction. The peripheries of the surface side terminals are sealed with a sealing resin, and the end faces of the surface side terminals are exposed from a sealing resin layer, whereby redistribution wiring is performed at the surface of the sealing resin layer.