Double-Sided FPCB Image Sensor Module for Compact Design

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Solution Overview

Problem

Conventional image sensor modules using the COF method face challenges in miniaturization due to the one-story structure, leading to increased module size and limitations in heat emission and electrical performance, while the COB method requires additional space for wire connections, increasing module size and process costs.

Innovation Solution

The image sensor module is designed with the image sensor on one side of a double-sided flexible printed circuit board (FPCB) and multilayer ceramic capacitors on the opposite side, utilizing an anisotropic conductive film and non-conductive polymer for attachment, allowing for reduced module size and improved heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the COF method is used with a one-story structure, then the manufacturing process is simplified, but the module size increases and heat emission performance deteriorates

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidmodule size

Core Design Contradiction:

Ease of manufactureVSVolume of stationary object

Solution Approach 1:

The patent transitions from a one-story structure to a two-story structure by utilizing both sides of the FPCB. The image sensor is mounted on one side while electronic components are mounted on the opposite side, effectively adding a vertical dimension to the layout and reducing the horizontal footprint of the module.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the module into two distinct functional layers: the image sensor side and the electronic components side. This segmentation allows independent optimization of each side's layout and function, enabling compact integration while maintaining manufacturing simplicity.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If the COF method is used with a one-story structure, then the manufacturing process is simplified, but heat emission performance deteriorates

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidheat emission

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

By moving electronic components to the opposite side of the FPCB from the image sensor, the patent creates spatial separation between heat-generating components and the temperature-sensitive image sensor. This dimensional reorganization improves thermal management without complicating the manufacturing process.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If the COB method is used with wire connections, then electrical performance is improved, but the module size increases

Engineering Contradiction:

Improveelectrical performanceVSAvoidmodule size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent extracts the wire connection requirement from the COB method by adopting the COF method with bump connections. This eliminates the need for additional wire bonding space while maintaining reliable electrical connections between the image sensor and the FPCB.

Inventive Principle:

Principle #2Taking out (Extraction)

4Adaptability or versatility

If additional electronic components are integrated, then functionality is improved, but the module size increases

Engineering Contradiction:

ImprovefunctionalityVSAvoidmodule size

Core Design Contradiction:

Adaptability or versatilityVSVolume of stationary object

Solution Approach 1:

The patent utilizes the opposite side of the FPCB as an additional dimension for component placement. This allows integration of multiple electronic components (capacitors, resistors, etc.) without increasing the module's horizontal footprint, thereby improving functionality while maintaining compact size.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the overall size of the camera module, enhances heat emission and electrical performance, and allows for the integration of additional components, thereby improving reliability and competitiveness in cost and product design.

Implementation Method 1

utilizing an anisotropic conductive film and non-conductive polymer for attachment

Methodology Applied

Scientific EffectAnisotropic conduction: Anisotropy

Implementation Method 2

enhances heat emission and electrical performance

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7796882B2Image sensor module, method of manufacturing the same, and camera module using the same

Publication Date: 2010.09.14 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

The present invention relates to a method of manufacturing an image sensor module including attaching an image sensor on one side of a double-sided flexible printing circuit board (FPCB) provided with a window such that the image sensor module covers the window; and mounting at least one electric part on the other side of the double-sided FPCB on which the image sensor is attached.