Double-Sided Heat Dissipation Semiconductor Package
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving effective heat dissipation, particularly for high-integrated chips, as heat is primarily exhausted through a single surface, leading to inefficient heat management, which is critical for applications like electric vehicle converters where heat dissipation directly impacts efficiency.
Innovation Solution
A double-sided heat dissipation structure is implemented, where one surface of the package body is exposed to both upper and lower substrates, with metal units bonded to both the semiconductor chip and substrates to facilitate heat transfer to both surfaces, enhancing heat dissipation by connecting the semiconductor chip to both substrates through metal units and using materials like ceramic or aluminum nitride substrates with high heat conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is exhausted only through the lower portion of the semiconductor package, then the package structure is simple, but the heat dissipation effect is insufficient
Solution Approach 1:
The patent transitions from single-sided heat dissipation (lower portion only) to double-sided heat dissipation by exposing both the lower portion of the first substrate and the upper portion of the second substrate. This dimensional expansion allows heat to be dissipated through two opposite surfaces simultaneously, effectively doubling the heat dissipation pathways without proportionally increasing structural complexity.
Solution Approach 2:
The package structure is segmented into multiple functional layers including the first substrate with exposed lower portion, the semiconductor chip, and the second substrate with exposed upper portion. Each layer is optimized for specific functions: the first substrate and second substrate serve as heat dissipation surfaces, while the semiconductor chip is positioned between them for efficient thermal coupling.
2Temperature
If the semiconductor chip is connected to substrates through wire bonding, then electrical connection is achieved, but heat transfer efficiency is poor
Solution Approach 1:
The patent introduces metal units as intermediary elements between the semiconductor chip and the substrates. These metal units serve dual purposes: providing electrical connection and acting as heat sinks. The metal units are directly bonded to the semiconductor chip and thermally coupled to both the first and second substrates, creating an efficient thermal pathway that bypasses the limitations of wire bonding.
Solution Approach 2:
The connection structure employs composite material architecture combining different materials with complementary properties: the semiconductor chip, metal units with high thermal conductivity, and substrate materials optimized for thermal management. This composite approach enables simultaneous achievement of electrical connectivity and efficient heat transfer.
3Volume of moving object
If a stacked double chip structure is used, then space utilization is improved, but heat dissipation effect is reduced
Solution Approach 1:
The patent reconfigures the stacked structure to enable vertical heat dissipation pathways. By exposing the upper portion of the second substrate in addition to the lower portion of the first substrate, the design creates three-dimensional heat dissipation channels that extend in multiple directions, allowing heat to escape from both top and bottom surfaces of the stacked assembly.
Solution Approach 2:
Different regions of the package are assigned different thermal functions: the lower portion of the first substrate and the upper portion of the second substrate are specifically designed as heat dissipation surfaces with exposed areas, while the internal regions maintain compact stacking for space efficiency. This local differentiation optimizes both space utilization and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure allows for enhanced heat dissipation by transferring heat generated from the semiconductor chip to both the upper and lower substrates, improving thermal management and maintaining structural stability while minimizing space occupation.
Implementation Method 1
a first metal unit in which one side is bonded to an upper surface of the semiconductor chip and the other side is bonded to a lower surface of the second substrate... heat generated from the semiconductor chip is exhausted not only to the lower substrate, but also to the upper substrate
Data Source
AI summary
The present disclosure relates to a semiconductor package having a double-sided heat dissipation structure, and more particularly, to a semiconductor package having a double-sided heat dissipation structure which rapidly transfers high heat generated in a semiconductor chip to substrates exposed to upper and lower surfaces of the package to have excellent dissipation effect.That is, a semiconductor package having a double-sided heat dissipation structure of the present disclosure includes a package body formed by molding, a first substrate which is provided at an inner lower portion of the package body and has a lower surface exposed to the outside of the package body, a semiconductor chip mounted on an upper surface of the first substrate, a lead frame which is attached to the first substrate and extends to the outside of the package body, a second substrate which is provided at an inner upper portion of the package body and has an upper surface exposed to the outside of the package body, a first metal unit in which one side is bonded to an upper surface of the semiconductor chip and the other side is bonded to a lower surface of the second substrate, and a second metal unit in which one side is bonded to an upper surface of the first substrate and the other side is bonded to the lower surface of the second substrate.