Double-Sided Heat Exchanger for Enclosure Thermal Management
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Solution Overview
Problem
Electrical enclosures require effective heat transfer solutions to manage high internal temperatures while maintaining a sealed environment, as elevated temperatures significantly reduce electronic component lifespan, and existing cooling methods like air conditioners are energy-intensive or limited in capacity.
Innovation Solution
A double-sided heat exchanger with embedded heat pipes provides a direct path for thermal conduction between internal and external gas streams, increasing surface area and reducing thermal resistance for efficient heat transfer without direct fluid contact, using a larger external heat sink and fins to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air conditioners are used for cooling enclosures, then sub-ambient temperatures can be achieved, but energy consumption increases significantly
Solution Approach 1:
The patent replaces the mechanical compression system of air conditioners with a passive heat exchanger system that uses thermal conduction and convection. The heat exchanger transfers heat from the enclosure interior to the exterior environment through thermal conduction across the wall assembly, eliminating the need for mechanical compressors and refrigerants, thereby dramatically reducing energy consumption while maintaining effective cooling.
Solution Approach 2:
The patent extracts the active cooling mechanism (compressor and refrigerant cycle) from the system and replaces it with a passive thermal management approach. By removing the energy-intensive mechanical components and relying on natural heat transfer processes through the heat exchanger integrated into the wall assembly, the system achieves cooling without the high energy consumption associated with traditional air conditioners.
2Productivity
If heat exchanger surface area is increased by adding fins, then heat transfer efficiency improves, but device complexity increases
Solution Approach 1:
The patent merges the heat exchanger functionality directly into the wall assembly structure. The heat exchanger is integrated with the wall's structural components, combining thermal management with the enclosure's structural framework. This integration allows fin structures to be incorporated for enhanced heat transfer while maintaining structural efficiency and avoiding the complexity of separate, standalone heat exchanger systems.
Solution Approach 2:
The patent applies fin structures selectively at specific locations within the heat exchanger assembly where heat transfer enhancement is most needed. Rather than uniformly complicating the entire structure, fins are strategically positioned to maximize heat dissipation efficiency at critical areas, thereby improving heat transfer productivity without proportionally increasing overall device complexity.
3Temperature
If thermal resistance is reduced for heat transfer, then internal temperature can be maintained lower, but the difference between internal and external temperature required for heat transfer decreases
Solution Approach 1:
The patent employs composite wall assemblies that combine materials with different thermal properties. The heat exchanger integrates high thermal conductivity materials for heat transfer paths with insulating materials in other regions. This composite structure reduces thermal resistance where needed for efficient heat removal while managing the thermal gradient requirements, allowing lower internal temperatures to be maintained with reduced temperature differences between interior and exterior environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient heat transfer with reduced thermal resistance, maintaining lower internal temperatures and extending electronic component lifespan while minimizing energy consumption and equipment costs.
Implementation Method 1
provides a direct path of thermal conduction between the first gas stream and the second gas stream
Implementation Method 2
providing heat pipes in the heat exchanger. The heat pipes can be embedded between an internal side of a double-sided heat exchanger and the external side, so that heat can be transferred with little thermal resistance
Implementation Method 3
Increasing the surface area of a heat exchanger by adding an extended surface or fin structure can increase heat transfer through the heat exchanger
Implementation Method 4
a first heat sink that is in thermal communication with the first gas stream
Data Source
AI summary
A cooling unit positioned between a first and a second gas stream, the first and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger. A housing surrounds a fan and the second fins.