Double-Sided Heat Sink Fixing Device for I/O Card Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation methods for high-density input/output cards fail to maintain operating temperature within a limited range due to cooling portions being confined in a narrow space, leading to reduced performance.
Innovation Solution
A double-sided heat sink system with a fixing device that includes cylindrically-shaped rods and flexible latches to securely mount cooling portions on both sides of a carrier, utilizing a heat pipe for enhanced heat transfer and dissipation, with flexible designs to prevent vibration and ensure contact with the chip and air for effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional heat dissipation apparatus is arranged over the chip, then the chip is cooled, but the cooling portions are located in a narrow space between the I/O card and the main board, leading to reduced heat dissipation performance
Solution Approach 1:
The patent transitions from a single-sided heat sink to a double-sided heat sink configuration. The first cooling portion contacts the chip on one side of the carrier, while the second cooling portion extends to the opposite side, utilizing three-dimensional space to increase the heat dissipation surface area and improve thermal management performance.
Solution Approach 2:
The heat dissipation system is divided into two independent cooling portions: a first cooling portion for direct contact with the chip and a second cooling portion for extended heat dissipation on the opposite side of the carrier. This segmentation allows each cooling portion to be optimized for its specific function while working together to solve the heat dissipation problem.
2Productivity
If a double-sided heat sink is used to improve heat dissipation, then heat dissipation performance is enhanced, but the complexity of the fixing device increases
Solution Approach 1:
The patent integrates multiple fixing functions into a single unified fixing device. The first holder with its flexible latch and limiting protrusion combines the functions of securing the first cooling portion, limiting its position, and providing a mounting interface for the second cooling portion, thereby reducing the number of separate components needed.
Solution Approach 2:
The first holder serves multiple functions: it fixes the first cooling portion to the carrier, limits the position of the first cooling portion, provides a mounting interface for the second cooling portion, and maintains the gap between components. This multi-functionality reduces overall device complexity while achieving the desired heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively dissipates heat by utilizing a double-sided heat sink with a heat pipe for improved thermal management, maintaining operating temperatures and enhancing heat dissipation performance by allowing better airflow and contact with the chip and air.
Implementation Method 1
a heat pipe through which the first cooling portion and the second cooling portion are connected to perform heat transfer
Data Source
AI summary
Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier. The fixing device comprises: a first holder including a first cylindrically-shaped rod, wherein the first cylindrically-shaped rod can pass through a first cooling portion of the double-sided heat sink and a mounting hole of the carrier to fix the first cooling portion to a first side of the carrier, and the first cylindrically-shaped rod comprises a through-hole extending along a longitudinal direction; and a second holder including a second cylindrically-shaped rod, wherein the second cylindrically-shaped rod can pass through a mounting hole of a second cooling portion of the double-sided heat sink and the through-hole of the first holder, such that the second holder is coupled with the first holder to fix the second cooling portion to a second side of the carrier opposite to the first side.