Double-Sided Hermetic Multichip Module for Downhole Reliability
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Solution Overview
Problem
Current double-sided multi-chip modules (MCMs) are not suitable for harsh downhole environments due to inadequate protection of surface-mounted components, leading to reduced reliability and lifetime, and existing solutions result in a large footprint, making them unsuitable for compact applications.
Innovation Solution
A double-sided hermetically sealed electronic module with a ceramic substrate, where both sides are equipped with discrete electronic components attached using glue or epoxy, and protected by metallic or ceramic ring structures with a hermetically sealed cavity, eliminating the need for solder and minimizing interference and footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a double-sided MCM is used to reduce footprint, then the area is reduced, but the reliability deteriorates because surface-mounted components on the lower side are unprotected
Solution Approach 1:
The protective structure is segmented to cover both sides of the substrate separately. Each side has its own cavity and lid configuration, allowing independent protection of components on the upper and lower surfaces while maintaining a compact overall structure.
Solution Approach 2:
The lower side cavity and lid are nested within or integrated with the upper side protective structure. The lower lid is positioned beneath the upper cavity structure, creating a nested arrangement that protects both sides without significantly increasing the footprint.
2Manufacturing precision
If solder is used to attach surface-mounted components, then the manufacturing precision is improved, but the reliability deteriorates in harsh environments due to solder degradation at high temperatures
Solution Approach 1:
The attachment method is changed from soldering to adhesive bonding. This parameter change eliminates the thermal degradation issues associated with solder while maintaining adequate attachment precision through controlled adhesive application and curing processes.
Solution Approach 2:
The adhesive material serves as a replaceable attachment medium that can be optimized for specific temperature ranges. While individual adhesives may have temperature limitations, the overall system reliability is improved by selecting adhesives suitable for the operating environment, avoiding solder's fundamental thermal degradation problem.
3Device complexity
If electronic components are exposed to harsh downhole environments, then the device complexity is reduced, but the lifetime deteriorates due to environmental degradation
Solution Approach 1:
Protective cavities and lids are integrated into the substrate structure during manufacturing, before the device is deployed to the harsh environment. This preliminary protection prevents environmental degradation from the outset, extending component lifetime without adding complex protective systems.
Solution Approach 2:
The protective structure utilizes composite construction with ceramic or Kovar substrates and lids, creating a hermetically sealed environment that resists harsh conditions. The composite material structure provides both mechanical strength and environmental barrier properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced temperature stability, reduced interference, and a compact design, enabling the module to withstand high temperatures and pressures, significantly extending the lifetime and reliability of electronic components in harsh environments.
Implementation Method 1
a first hermetic seal is provided which surrounds a first cavity formed in the substrate and has a first semiconductor device mounted therein, and a second hermetic seal is provided which surrounds a second cavity formed in the substrate and has a second semiconductor device mounted therein
Data Source
AI summary
A packaged electronic module for downhole applications, in particular in a petrochemical well or similar environment. The electronic module includes one or more electronic components located on each side of a substrate, where the one or more electronic components are attached to the substrate by means of glue.