Double-Sided Imprint Chuck Structure for 300 mm Gap Uniformity
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Solution Overview
Problem
Existing imprint lithography technologies face challenges in precisely controlling the imprint gap and maintaining uniformity over larger wafer sizes, such as 300 mm, due to insufficient stiffness and thermal management issues in the chuck and groove plate design, leading to reduced process quality and longer heating/cooling times.
Innovation Solution
The invention introduces a two-component frame chuck manipulator with a sub-frame and main frame actuator system, combined with an interface plate and chuck actuators, allowing precise control of the imprint gap and rotation, and a lattice arrangement for thermal management, ensuring uniformity and stiffness across the chuck area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the wafer size is increased to 300 mm, then the processing area is improved, but the imprint gap uniformity deteriorates due to insufficient stiffness
Solution Approach 1:
The chuck is divided into a two-component frame structure with a sub-frame and main frame, where the sub-frame provides localized support and the main frame provides overall structural stability. This segmentation allows the system to maintain stiffness across large areas while enabling precise control of the imprint gap uniformity.
2Area of stationary object
If the chuck size is increased to support larger wafers, then the processing capacity is improved, but the thermal management efficiency deteriorates due to increased thermal mass
Solution Approach 1:
The chuck is segmented into a frame structure with distributed heating/cooling channels rather than a solid mass. This segmentation reduces the thermal mass while maintaining the structural area needed to support large wafers, thereby improving heating and cooling efficiency.
3Device complexity
If the groove plate and chuck are designed as single-component structures, then the device complexity is reduced, but the control precision of imprint gap and rotation deteriorates
Solution Approach 1:
The manipulator is segmented into a two-component frame structure with sub-frame and main frame actuators. This segmentation enables independent control of different degrees of freedom, improving the precision of imprint gap and rotation control while maintaining manageable device complexity through modular design.
4Ease of manufacture
If the chuck structure is simplified to reduce manufacturing cost, then the ease of manufacture is improved, but the stiffness and uniformity deteriorate
Solution Approach 1:
The chuck is designed as a segmented frame structure with standardized components and distributed support elements. This segmentation allows for modular manufacturing processes that simplify fabrication while maintaining high stiffness through the distributed structural framework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables precise control of the imprint gap and rotation, maintaining uniformity and stiffness, facilitating reliable double-sided imprinting on larger wafers while reducing thermal mass and improving heating/cooling efficiency.
Implementation Method 1
the chuck comprises a fluid passage arrangement for coupling to the openings of the array
Data Source
AI summary
An imprinting apparatus comprises a first carrier for carrying a flexible stamp having an imprinting pattern and a second carrier movable relative to the first carrier and configured to carry a substrate having a resist layer. The second carrier comprises a chuck and an interface plate over the chuck, wherein the interface plate comprises an array of openings for receiving already-imprinted areas of one side of a substrate while an opposite side of the substrate is to be imprinted. The chuck comprises a fluid passage arrangement for coupling to the openings of the array.